Femtosecond laser drilling of alumina ceramic substrates

Wang, X. C.; Zheng, Hui; Chu, PL; Tan, Jun; Teh, Kim Ming; Liu, T.; Ang, Bryden C.Y.; Tay, G.H.

doi:10.1007/s00339-010-5816-8

Cited by 65 publications

(25 citation statements)

References 11 publications

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“…Presently, femtosecond pulsed laser has been proven to be an efficient tool for some ceramics (as well as metals, glasses, living tissues, etc. ), such as silicon carbide [14], alumina [15][16][17], zinc oxide [18] and composite ceramics [19][20][21][22][23]. Zhao et al [14] deduced the ablation threshold of silicon carbide based on experiment, and produced a group of patterned microstructures.…”

Section: Introductionmentioning

confidence: 98%

“…Zhao et al [14] deduced the ablation threshold of silicon carbide based on experiment, and produced a group of patterned microstructures. Wang et al [15] investigated the drilling of alumina ceramic substrates with 381 μm thickness by femtosecond laser. Li et al [16] studied the topography, radial spread and chemical composition of the slag produced during processing on alumina wafers.…”

Section: Introductionmentioning

confidence: 99%

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Micromachining features of TiC ceramic by femtosecond pulsed laser

Zhang

Wang

Zhang

et al. 2015

Ceramics International

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Section: Introductionmentioning

confidence: 98%

Section: Introductionmentioning

confidence: 99%

Micromachining features of TiC ceramic by femtosecond pulsed laser

Zhang

Wang

Zhang

et al. 2015

Ceramics International

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“…Thus, laser drilling has been considered as alternative non-contact via-hole fabrication method. Previous studies demonstrated the via hole drilling processes based on nanosecond [8][9][10], picosecond [11], and femtosecond [12][13][14][15][16][17][18] lasers. However, systematic studies on mc-Si drilling by ultrafast lasers are rare.…”

Section: Introductionmentioning

confidence: 99%

Femtosecond laser drilling of crystalline and multicrystalline silicon for advanced solar cell fabrication

et al. 2012

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The rear contact solar cell concept has been implemented to increase the solar cell efficiency. Practically, it necessitates rapid fabrication of a large number of via holes to form low-loss current paths. It is not a trivial task to drill a number of microscopic holes through a typical Si wafer of ∼200 µm thickness at reasonable processing throughput and yield. In this research, a femtosecond laser is employed to drill via holes in both crystalline silicon (c-Si) and multicrystalline silicon (mc-Si) thin wafers of ∼170 µm thickness with various laser parameters such as number of laser shots and pulse energy. Since a significantly high pulse energy compared to ablation threshold is mainly applied, aiming to achieve a rapid drilling process, the femtosecond laser beam is subjected to complex non-linear characteristics. Therefore, the relative placement of the sample with respect to the laser focal position is also rigorously examined. While the non-linear effect at high pulse energy regime is complex, it also facilitates the drilling process in terms of achieving high-aspect ratio, for example, by extending the effective depth of focus by non-linear effect. Cross-sectional morphological analysis in conjunction with on-line emission and shadowgraph imaging are carried out in order to elucidate the drilling mechanism.

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“…However, some authors [89,90] have managed to produce high aspect ratio and low tapered holes in alumina wafers suitable for micro-vias used in micro-electronic circuits. In trepanation mode, high fluences can be used in conjunction with other processing parameters in a way that minimizes heat accumulation and avoid recast molten material, cracks and delamination.…”

Section: Direct Writing Microstructures In Surfacesmentioning

confidence: 99%