Abstrm ---Bismuth titanate (Bi4Ti3O12) thin films were fabricated on (100)-oriented silicon substrates with bismuth silicate (Bi,SiO,) buffer layer by metal organic d e composition (MOD) method. It was confrmed that the resultant films weie single-phase Bi,Ti,O,, with c-axis dominant orientation. Thickness of Bi4Ti30L2 and Bi,SiO, layer were approximately 50 nm and 5 nm, respectively. The fabricated metal-ferroelectric-insulator-semiconductor (MFIS) structures, have relatively superior leakage current density of approximately IO-' A cm-' and high break-down applied voltage of approximately 10