Ferroelectric Copolymer-Based Plastic Memory Transistors

Yoon, Sung‐Min; Yang, Shinhyuk; Jung, Soon‐Won; Park, Sang‐Hee Ko; Byun, Chun‐Won; Ryu, Min-Ki; Oh, Himchan; Hwang, Chi‐Sun; Cho, Kyoung-Ik; Yu, Byoung–Gon

doi:10.5772/17547

Cited by 1 publication

(1 citation statement)

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“…The exact deformability requirements of a system depend on the target application. If only bending is required, often organic processing technology is used [9][10][11][12][13]. These electronics can be fabricated fairly inexpensively.…”

Section: Introductionmentioning

confidence: 99%

Fabrication and characterization of double curvature bendable silicon wafers

Lips¹,

Puers²

2018

J. Micromech. Microeng.

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We report the design and implementation of a unique, wafer sized stretchable and bendable monolithic silicon matrix structure.The achieved stretchability not only allows for one directional folding, but is capable to bend in two directions simultaneously, required to conform the structure to complex shapes such as spheres, tori, hyperboloids or a combination of them. Moreover, it also enables dynamic mechanical deformation of the structure to cope with a moving environment, like e.g. the wall of the heart muscle. The minimal measured bending radius is 8 mm, which is 20 % smaller than the current state of art. Furthermore, a new fabrication process is proposed that enables the use of common <100> wafers. This enables a broader and more accessible applicability compared to earlier work, that is based on non-standard <111> wafers, or the more expensive SOI wafers. The technique can lead to a revolutionary potential of applications, especially in the medical field, by enabling complex silicon monitoring systems to be linked to organs without hindering them.

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