2016
DOI: 10.1039/c6ra09987d
|View full text |Cite
|
Sign up to set email alerts
|

Ferroelectricity of low thermal-budget HfAlOx for devices with metal–ferroelectric–insulator–semiconductor structure

Abstract: The effect of annealing temperature on the ferroelectricity of HfAlOx with Al concentration of 4.5% is physically and electrically investigated by metal–ferroelectric–insulator–semiconductor (MFIS) platform.

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
2

Citation Types

0
16
1

Year Published

2017
2017
2023
2023

Publication Types

Select...
8

Relationship

0
8

Authors

Journals

citations
Cited by 25 publications
(17 citation statements)
references
References 35 publications
0
16
1
Order By: Relevance
“…Figure f shows a scanning transmission electron microscopy (STEM) image and the energy dispersive spectroscopy (EDS) elemental mapping of the cross section of the stacked dielectrics, revealing the spatial distributions of Hf, O, and Al. There are islands of coexisting Hf, Al, and O regions in the middle layer, which we assume to be the origin of the ferroelectric effects. These three layers each have their functions. The bottom HfO 2 layer provides a high-κ gate dielectric to ensure good gate control efficiency, which blocks the charge carriers in the channel, keeping them away from the ferroelectric layer to reduce interface scattering .…”
Section: Resultsmentioning
confidence: 99%
“…Figure f shows a scanning transmission electron microscopy (STEM) image and the energy dispersive spectroscopy (EDS) elemental mapping of the cross section of the stacked dielectrics, revealing the spatial distributions of Hf, O, and Al. There are islands of coexisting Hf, Al, and O regions in the middle layer, which we assume to be the origin of the ferroelectric effects. These three layers each have their functions. The bottom HfO 2 layer provides a high-κ gate dielectric to ensure good gate control efficiency, which blocks the charge carriers in the channel, keeping them away from the ferroelectric layer to reduce interface scattering .…”
Section: Resultsmentioning
confidence: 99%
“…It is known that, if of ferroelectric origin, the orientation should be clockwise if the ferroelectric is on p‐type semiconductor and counterclockwise if it is deposited on n‐type semiconductor. [ 11,12 ] Therefore, in Figure are shown the recorded C – V characteristics at temperatures where the shape is MFS like for both HZO deposited on p‐Ge and n‐Ge, with the arrows indicating the orientation of the C – V hysteresis.…”
Section: Resultsmentioning
confidence: 99%
“…28,29 It has been previously shown that increasing the post-metal annealing temperature significantly enhanced the P r . [30][31][32][33][34][35][36] The intensity of ferroelectricity depends on the quantity and quality of domains in the orthorhombic phase (o-phase), which can be enhanced by increasing the rapid thermal annealing (RTA) temperature or the annealing time. As-deposited HfO x -based materials are polycrystalline and possess various ratios of monoclinic (space group: P2 1 /s), tetragonal (P4 2 /nmc), and orthorhombic (Pca 1 ) phase grains.…”
Section: Introductionmentioning
confidence: 99%