2020 Ieee Sensors 2020
DOI: 10.1109/sensors47125.2020.9278692
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FET-Based Integrated Charge Sensor for Organ-on-Chip Applications

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Cited by 5 publications
(6 citation statements)
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“…In this regard, polyimide (PI) layers can be interposed, both to improve metal adhesion upon oxygen plasma surface activation on PDMS and as stress buffer to match the higher mechanical stiffness of metals. The latter can avoid deleterious consequences such as wrinkling and warpage [85][86]. PI can be formulated as adhesive in tape form (commercially known as Kapton), besides as photo-patternable photoresist.…”
Section: B Polymersmentioning
confidence: 99%
“…In this regard, polyimide (PI) layers can be interposed, both to improve metal adhesion upon oxygen plasma surface activation on PDMS and as stress buffer to match the higher mechanical stiffness of metals. The latter can avoid deleterious consequences such as wrinkling and warpage [85][86]. PI can be formulated as adhesive in tape form (commercially known as Kapton), besides as photo-patternable photoresist.…”
Section: B Polymersmentioning
confidence: 99%
“…For example, universal open-source potentiostats for assays have been reported, such as USB connected DStat [51] or Bluetooth operated Universal Wireless Electrochemical Detector (UWED) [52], which both have material cost below 100 EUR, and can support most common EC techniques, such as potentiometric measurements, CA, CV, SWV, and DPV. Further miniaturization is possible by direct CMOS integration of control electronics directly with organ chip devices [53].…”
Section: Integration Of Electrochemical Sensingmentioning
confidence: 99%
“…In this regard, we have demonstrated the integration of electrochemical charge microsensors within a MEM OoC device [33]. The 1-by-1 cm 2 OoC device is composed by a rigid silicon frame supporting a soft and optically transparent polymer membrane, and is fabricated by a largely CMOS-compatible process flow (Fig.…”
Section: Sensing: Integrated Fet-based Charge Sensormentioning
confidence: 99%