FIB∕SEM Structural Analysis Of Through-Silicon-Vias

Bender, Hugo; Drijbooms, C.; Radisic, Aleksandar

doi:10.1063/1.3657903

Cited by 6 publications

(2 citation statements)

References 13 publications

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“…-typically arise in FIB-tomography due to irregular milling rates caused by specimen inhomogeneity (Holzer et al, 2007). The presence of curtaining artifacts reduces interpretability for segmentation or object recognition (Bender et al, 2011). Figures 2b-c and 2e-f demonstrate that our approach can separate the corrupted image into the clean and stripped components.…”

Section: Resultsmentioning

confidence: 94%

Removing Stripes, Scratches, and Curtaining with Non-Recoverable Compressed Sensing

Schwartz¹,

Jiang²,

Wang³

et al. 2019

Microsc Microanal

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Highly-directional image artifacts such as ion mill curtaining, mechanical scratches, or image striping from beam instability degrade the interpretability of micrographs. These unwanted, aperiodic features extend the image along a primary direction and occupy a small wedge of information in Fourier space. Deleting this wedge of data replaces stripes, scratches, or curtaining, with more complex streaking and blurring artifacts-known within the tomography community as 'missing wedge' artifacts. Here, we overcome this problem by recovering the missing region using total variation minimization, which leverages image sparsity-based reconstruction techniquescolloquially referred to as compressed sensing-to reliably restore images corrupted by stripe-like features. Our approach removes beam instability, ion mill curtaining, mechanical scratches, or any stripe features and remains robust at low signal-to-noise. The success of this approach is achieved by exploiting compressed sensing's inability to recover directional structures that are highly localized and missing in Fourier Space.

show abstract

Section: Resultsmentioning

confidence: 94%

Removing Stripes, Scratches, and Curtaining with Non-Recoverable Compressed Sensing

Schwartz¹,

Jiang²,

Wang³

et al. 2019

Microsc Microanal

View full text Add to dashboard Cite

show abstract

“…2d) typically arise in FIB-tomography due to irregular milling rates caused by specimen inhomogeneity (Holzer et al, 2007). The presence of curtaining artifacts reduces interpretability for segmentation or object recognition (Bender et al, 2011). Figure 2 demonstrates that our approach can separate the corrupted image into the clean and stripped components.…”

Section: Resultsmentioning

confidence: 99%

Removing Stripes, Scratches, and Curtaining with Nonrecoverable Compressed Sensing

et al. 2019

View full text Add to dashboard Cite

Highly-directional image artifacts such as ion mill curtaining, mechanical scratches, or image striping from beam instability degrade the interpretability of micrographs. These unwanted, aperiodic features extend the image along a primary direction and occupy a small wedge of information in Fourier space. Deleting this wedge of data replaces stripes, scratches, or curtaining, with more complex streaking and blurring artifacts—known within the tomography community as “missing wedge” artifacts. Here, we overcome this problem by recovering the missing region using total variation minimization, which leverages image sparsity-based reconstruction techniques—colloquially referred to as compressed sensing (CS)—to reliably restore images corrupted by stripe-like features. Our approach removes beam instability, ion mill curtaining, mechanical scratches, or any stripe features and remains robust at low signal-to-noise. The success of this approach is achieved by exploiting CS's inability to recover directional structures that are highly localized and missing in Fourier Space.

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A Hybrid Non-destructive Measuring Method of Three-dimensional Profile of Through Silicon Vias for Realization of Smart Devices

Ahn

Bae

Park

et al. 2018

Sci Rep

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Smart devices have been fabricated based on design concept of multiple layer structures which require through silicon vias to transfer electric signals between stacked layers. Because even a single defect leads to fail of the packaged devices, the dimensions of the through silicon vias are needed to be measured through whole sampling inspection process. For that, a novel hybrid optical probe working based on optical interferometry, confocal microscopy and optical microscopy was proposed and realized for enhancing inspection efficiency in this report. The optical microscope was utilized for coarsely monitoring the specimen in a large field of view, and the other methods of interferometry and confocal microscopy were used to measure dimensions of small features with high speed by eliminating time-consuming process of the vertical scanning. Owing to the importance of the reliability, the uncertainty evaluation of the proposed method was fulfilled, which offers a practical example for estimating the performance of inspection machines operating with numerous principles at semiconductor manufacturing sites. According to the measurement results, the mean values of the diameter and depth were 40.420 µm and 5.954 µm with the expanded uncertainty of 0.050 µm (k = 2) and 0.208 µm (k = 2), respectively.

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FIB∕SEM Structural Analysis Of Through-Silicon-Vias

Abstract: Different milling strategies for the structural analysis of through-silicon-vias with a dualbeam focused ion beam/scanning electron microscope are discussed. Particular attention is given to methods to reduce the analysis time and to minimize the curtaining artifacts.

Cited by 6 publications

References 13 publications

Removing Stripes, Scratches, and Curtaining with Non-Recoverable Compressed Sensing

Removing Stripes, Scratches, and Curtaining with Non-Recoverable Compressed Sensing

Removing Stripes, Scratches, and Curtaining with Nonrecoverable Compressed Sensing

A Hybrid Non-destructive Measuring Method of Three-dimensional Profile of Through Silicon Vias for Realization of Smart Devices

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