Fiber-optic Fabry–Perot pressure sensor based on sapphire direct bonding for high-temperature applications

Li, Wangwang; Liang, Ting; Jia, Pinggang; Cheng, Liang; Hong, Yongtaek; Li, Yongwei; Yao, Zong Xiang; Liu, Wenyi; Xiong, Jijun

doi:10.1364/ao.58.001662

Cited by 48 publications

(14 citation statements)

References 28 publications

Supporting

Mentioning

Contrasting

Order By: Relevance

“…The large diameter and highly multimode nature of sapphire inhibit the migration from silica fibers to sapphire fibers in conventional interferometry [ 103 ]. Over the years, researchers have initially realized the fabrication of sapphire FPI using different fiber fusion [ 104 , 105 , 106 , 107 , 108 ], sapphire wafer fusion [ 109 , 110 , 111 , 112 ], and metal coating [ 113 , 114 , 115 , 116 ]. Fabry–Perot interferometric sensors can be divided into two main groups: intrinsic FPI (IFPI)and extrinsic FPI (EFPI) [ 63 ].…”

Section: Interferometric Sensorsmentioning

confidence: 99%

“…In recent years, air cavity EFPIs have been reported and successively applied for high-temperature sensing. The method is to etch the sapphire wafer [ 111 , 112 ] or sapphire fiber [ 118 ] first and then bond it directly with the sapphire wafer to form an air cavity. In 2017, Li et al proposed a direct sapphire bonding method using plasma surface activation, hydrophilic prebonding, and high-temperature annealing [ 111 ].…”

Section: Interferometric Sensorsmentioning

confidence: 99%

See 1 more Smart Citation

Optical Fiber Sensors for High-Temperature Monitoring: A Review

Pang

et al. 2022

Sensors

View full text Add to dashboard Cite

High-temperature measurements above 1000 °C are critical in harsh environments such as aerospace, metallurgy, fossil fuel, and power production. Fiber-optic high-temperature sensors are gradually replacing traditional electronic sensors due to their small size, resistance to electromagnetic interference, remote detection, multiplexing, and distributed measurement advantages. This paper reviews the sensing principle, structural design, and temperature measurement performance of fiber-optic high-temperature sensors, as well as recent significant progress in the transition of sensing solutions from glass to crystal fiber. Finally, future prospects and challenges in developing fiber-optic high-temperature sensors are also discussed.

show abstract

Section: Interferometric Sensorsmentioning

confidence: 99%

Section: Interferometric Sensorsmentioning

confidence: 99%

Optical Fiber Sensors for High-Temperature Monitoring: A Review

Pang

et al. 2022

Sensors

View full text Add to dashboard Cite

show abstract

“…At present, numerous high-temperature pressure sensors based on various principles, including silicon-on-insulator (SOI), silicon carbide (SiC), sapphire fiber, and wireless passive LC, have been developed [5][6][7][8][9][10]. In 2017, Zhang [11] et al proposed a novel ultra-high-pressure sensor combining a truncated cone structure and an SOI piezoresistive element for measuring pressure up to 1.6 GPa.…”

Section: Introductionmentioning

confidence: 99%

A Differential Split-Type Pressure Sensor for High-Temperature Applications

Jia

Sun

et al. 2021

IEEE Access

Self Cite

View full text Add to dashboard Cite

This study proposes a split-type pressure sensor based on differential capacitance that can be applied to in-situ accurate pressure testing in high-temperature environments. The sensor is mainly composed of a high-temperature resistant chip and a high-temperature resistant encapsulation structure. The chip is made of a ceramic substrate and presents a differential capacitance structure that can withstand high temperatures and effectively restrain the temperature drift. The encapsulation presents a split-type structure, in which the chip and the test circuit board are placed at the front and back ends of the sensor, respectively. Therefore, the front end of the sensor can work in the high-temperature area for in-situ testing, while the back-end temperature remains below 60℃ all the time, which ensures normal operation of the circuit board. Finally, the test results show that the pressure sensor's temperature drift coefficient is only 6.6% within the temperature range of 25°C-400℃. The sensor's sensitivity can reach 9.27 mV/kPa and the maximum repeatability error is less than 2.2% at 400℃, which shows that the proposed sensor has a higher working temperature and higher precision than the existing pressure sensors.

show abstract

“…SiO 2 and glass) and enhance their bonding strength [19]- [22]. Li et al proposed a hydrophilic sapphire wafer bonding method by combining O 2 plasma activation and high temperature bonding process, which have been successfully applied in wireless passive sensors and fiber-optic pressure sensors for harsh environments [23]- [26]. Silke H. Christiansen et al also enhanced the bonding energy of wafers via high temperature annealing process [27], [28].…”

Section: Introductionmentioning

confidence: 99%

Hydrophilic Direct Bonding of MgO/MgO for High-Temperature MEMS Devices

Liu

Jia

et al. 2020

IEEE Access

Self Cite

View full text Add to dashboard Cite

Single-crystalline magnesium oxide (MgO) is an attractive material of substrates for hightemperature devices and high-temperature superconducting films. However, it is difficult to achieve the direct bonding of MgO/MgO because of its high brittleness and hardness, as well as the weak bonding force between the crystal faces. In this paper, we presented a hydrophilic direct bonding method of MgO by using two-step surface activation and a high-temperature annealing process. The bonding strengths under different annealing temperatures, pressures and times were measured. A high bonding strength (∼7 MPa) and a fine bonding interface without any microcracks and voids were obtained after annealing at 1200 • C, 140 min and 4 MPa. The bonding interface was characterized by scanning electron microscopy (SEM) and transmission electron microscopy (TEM). The bonding mechanism of MgO/MgO was also clearly clarified. For the demo application, a MgO sealed cavity was formed by using the direct bonding method which is commonly used in the microelectromechanical systems (MEMS) devices for harsh environment applications. INDEX TERMS MgO single crystal, direct bonding, surface activation, high temperature annealing, bonding interface.

show abstract

Fiber-optic Fabry–Perot pressure sensor based on sapphire direct bonding for high-temperature applications

Cited by 48 publications

References 28 publications

Optical Fiber Sensors for High-Temperature Monitoring: A Review

Optical Fiber Sensors for High-Temperature Monitoring: A Review

A Differential Split-Type Pressure Sensor for High-Temperature Applications

Hydrophilic Direct Bonding of MgO/MgO for High-Temperature MEMS Devices

Contact Info

Product

Resources

About