Fiducial mark and CTOA estimates of thin film adhesion

Volinsky, Alex A.; Moody, N. R.

doi:10.1023/a:1024983930481

Cited by 6 publications

(3 citation statements)

References 23 publications

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“…In this case, water is transported with the advance of the crack tip at about 10 lam/minute, although higher propagation rates, up to several microns per second were observed in other samples. It has been previously shown that interfacial cracks in thin films act as a vacuum cleaner, collecting contaminants from the atmosphere, thus reducing the energy of the newly-formed fracture surfaces [ 11,12]. In this case, crack is acting like a pump, transporting fluid along with the blister propagation, and water droplets are seen on the Si substrate in Figure 3.…”

Section: Introductionmentioning

confidence: 94%

Micro-fluidic applications of telephone cord delamination blisters

2004

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Argon pressure significantly affects the residual stress in sputter deposited thin films and coatings. In case of W thin films, high residual stresses on the order of 1-2 GPa are quite common. With the rest of sputtering parameters being equal, argon pressure determines the sign and the value of residual stress.When the amount of stored elastic energy in the film due to the residual stress exceeds the interfacial toughness, fracture normally occurs. Telephone cord buckling delamination blisters are commonly observed in compressed thin films. These mechanically active features form by a loss of adhesion between the film and the substrate due to residual stress relief, and exhibit directional growth under certain conditions. This paper considers telephone cord delamination channels for micro-fluidics applications, as this could to be a valuable, reliable, and inexpensive method of forming open channels.

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Section: Introductionmentioning

confidence: 94%

Micro-fluidic applications of telephone cord delamination blisters

2004

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“…This value is referred to as the critical CTOA. The critical CTOA fracture criterion is widely used to describe fracture behavior [12,13].…”

Section: Calculation Of Some Parameters 331 Ctoa and Othersmentioning

confidence: 99%

A novel method for failure analysis based on three-dimensional analysis of fracture surfaces

Cao

Nie

et al. 2014

Engineering Failure Analysis

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“…In recent years, more quantitative methods such as the blister test (Jensen, 1991;Jensen and Thouless, 1993), modified indentation tests (de Boer and Gerberich, 1996a,b;Vlassak et al, 1997;Kriese et al, 1999a,b;Begley et al, 2000), the modified scratch test (de Boer et al, 1997), tests using residual stress in the film itself or in an adjacent layer (Bagchi et al, 1994;Bagchi and Evans, 1996;Zhuk et al, 1998;Hay et al, 2001;Buchwalter, 2001;Kinbara et al, 1998), a test using electro-static force (Yang et al, 1997), the four-point flexure test (Dauskardt et al, 1998;Lane et al, 2000) and others (Kamiya et al, 2002;Xie and Sitaraman, 2003;Volinsky et al, 2003) have been proposed. We proposed an evaluation method for initiation criterion of an interface crack due to the free-edge effect on the basis of fracture mechanics, and its validity was examined experimentally (Kitamura et al, 2002(Kitamura et al, , 2003.…”

Section: Introductionmentioning

confidence: 99%