2009
DOI: 10.1109/tuffc.2009.1110
|View full text |Cite
|
Sign up to set email alerts
|

Filled and unfilled temperature-dependent epoxy resin blends for lossy transducer substrates

Abstract: In the context of our ongoing investigation of low-cost 2-dimensional (2-D) arrays, we studied the temperature-dependent acoustic properties of epoxy blends that could serve as an acoustically lossy backing material in compact 2-D array-based devices. This material should be capable of being machined during array manufacture, while also providing adequate signal attenuation to mitigate backing block reverberation artifacts. The acoustic impedance and attenuation of 5 unfilled epoxy blends and 2 filled epoxy bl… Show more

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
1

Citation Types

0
1
0

Year Published

2010
2010
2024
2024

Publication Types

Select...
3
1

Relationship

0
4

Authors

Journals

citations
Cited by 4 publications
(1 citation statement)
references
References 12 publications
0
1
0
Order By: Relevance
“…The most commonly used backing material is a metal-loaded polymer composite [5,6,7,8]. Control of acoustic impedance and attenuation is certainly determined by the concentration of the loaded metal [9,10].…”
Section: Introductionmentioning
confidence: 99%
“…The most commonly used backing material is a metal-loaded polymer composite [5,6,7,8]. Control of acoustic impedance and attenuation is certainly determined by the concentration of the loaded metal [9,10].…”
Section: Introductionmentioning
confidence: 99%