Fine Pitch Inductively Coupled Connectors for Multi-Gbps Pulse Signaling

Abstract

We demonstrate multi-Gbps pulse signaling with lOOum diameter coupled inductors across a substrate to substrate interface. This has application in realizing sub-mm pitch surface mount zero insertion force (ZIF) connector interconnect structures.

Multi-bit fractional equalization for multi-Gb/s inductively coupled connectors

“…For level 2 & 3 interconnections, connectors and sockets, multi-Gb/s inductively coupled interconnect has been demonstrated at sub-millimeter pitch ( Fig. 1) [2][3][4]. For all three levels of interconnection, high-speed signaling has been demonstrated using inductors composed of 5 mm or less trace widths and spacings, creating transformers with sub 200 mm diameters and gap spacings of 5 mms or less.…”

“…Additionally, inductive coupling has an advantage over capacitive coupling when placed in a transmission line since the frequency-dependent impedance of a series capacitor can lead to significant return loss due to reflections. When a low-loss 1:1 turns ratio transformer is used, the impedance at the input to the transformer is very close to the impedance at the output, thus minimizing reflections [2][3][4].…”