Finite element analysis of uniaxial bending of ultra-thin silicon dies embedded in flexible foil substrates

Palavesam, Nagarajan; Landesberger, Christof; Kutter, Christoph; Bock, Karlheinz

doi:10.1109/prime.2015.7251353

Cited by 7 publications

(7 citation statements)

References 9 publications

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“…This point has to be considered when designing flexible electronics. Palavesam et al [ 25 , 29 ] compared the breaking strength of bare thin chips and chips embedded in flexible foil. They found that chips embedded in flexible film substrates have a higher breaking strength, up to 80% more than bare chips.…”

Section: Mechanics Of Bendingmentioning

confidence: 99%

“…Since the ultra-thin chips are mechanically very flexible and can achieve a deflection higher than their thickness, resulting in very small bending radii, their bending stress cannot be evaluated with classical beam theory. However, the investigation of this bending stress and achievable bending radii is of great relevance, since this information is the key to the design and manufacture of more robust and reliable flexible electronic systems [ 25 , 29 ].…”

Section: Mechanics Of Bendingmentioning

confidence: 99%

“…The reason for this stress can be mechanical as well as thermal load. As a result, a displacement occurs at this breaking strength, which is called fracture displacement [ 25 , 29 ]. However, applying a pure tensile stress is complicated because the components integrated in flexible electronics have very small dimensions.…”

Section: Mechanics Of Bendingmentioning

confidence: 99%

“…The mechanical reliability of these flexible electronics is very important to ensure the growing market demand for those systems. Furthermore, the robustness of the components and their integration should be optimized [ 25 , 26 ]. Ultra-thin chips are very common in flexible electronics and therefore need to be strong enough to withstand the tension that occurs during production and handling [ 12 ].…”

Section: Introductionmentioning

confidence: 99%

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Bending Setups for Reliability Investigation of Flexible Electronics

et al. 2021

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Flexible electronics is a rapidly growing technology for a multitude of applications. Wearables and flexible displays are some application examples. Various technologies and processes are used to produce flexible electronics. An important aspect to be considered when developing these systems is their reliability, especially with regard to repeated bending. In this paper, the frequently used methods for investigating the bending reliability of flexible electronics are presented. This is done to provide an overview of the types of tests that can be performed to investigate the bending reliability. Furthermore, it is shown which devices are developed and optimized to gain more knowledge about the behavior of flexible systems under bending. Both static and dynamic bending test methods are presented.

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Section: Mechanics Of Bendingmentioning

confidence: 99%

Section: Mechanics Of Bendingmentioning

confidence: 99%

Section: Mechanics Of Bendingmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Bending Setups for Reliability Investigation of Flexible Electronics

et al. 2021

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“…A majority of the aforementioned applications require devices that are anticipated to bend repeatedly during the device usage, for, e.g., sensors and actuators placed in smart plasters and electronic skin. However, FHE is a relatively younger field of research that is still in its nascent stages of development and hence, information available regarding the static [27][28][29][30][31][32] as well as dynamic bending reliability [33][34][35][36] of FHE components is rather very limited. Several studies have shown that the failure of chip-foil packages during repeated bending occur mainly because of the cracking of interconnects rather than the delamination of the chip from foil or chip fracture [34][35][36].…”

Section: Introductionmentioning

confidence: 99%

Influence of Flexibility of the Interconnects on the Dynamic Bending Reliability of Flexible Hybrid Electronics

et al. 2020

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The growing interest towards thinner and conformable electronic systems has attracted significant attention towards flexible hybrid electronics (FHE). Thin chip-foil packages fabricated by integrating ultra-thin monocrystalline silicon integrated circuits (ICs) on/in flexible foils have the potential to deliver high performance electrical functionalities at very low power requirements while being mechanically flexible. However, only very limited information is available regarding the fatigue or dynamic bending reliability of such chip-foil packages. This paper reports a series of experiments where the influence of the type of metal constituting the interconnects on the foil substrates on their dynamic bending reliability has been analyzed. The test results show that chip-foil packages with interconnects fabricated from a highly flexible metal like gold endure the repeated bending tests better than chip-foil packages with stiffer interconnects fabricated from copper or aluminum. We conclude that further analysis work in this field will lead to new technical concepts and designs for reliable foil based electronics.

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Roll-to-roll processing of film substrates for hybrid integrated flexible electronics

Palavesam

Marı́n

Hemmetzberger

et al. 2018

Flex. Print. Electron.

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Roll-to-roll (R2R) processing on film substrates has been demonstrated to have the potential for achieving high throughput manufacturing of organic electronic systems at low cost. However, the ever-growing mobile devices market accompanied by the developments in information and communication technologies require high performance systems at very low power operation, sometimes on larger substrates having sizes in the range of a few metres. Organic electronics often fall short of fulfilling the required computing performance and power requirements of most of the common use cases. Hybrid integration of inorganic monocrystalline silicon chips on polymer films is a means to fulfil the aforementioned requirements. In this context, it is opportune to report our recent activities on R2R processing of plastic films for hybrid integration of flexible electronics. Hybrid integration can be performed with conventional, rigid surface mount devices as well as flexible, ultrathin bare silicon chips. The first section of the paper is dedicated to a brief overview of R2R manufacturing of electronic devices with an example of production of radio frequency identification tags as well as to a discussion emphasising the targets for hybrid integration. Then, detailed descriptions about our processes for R2R manufacturing of metal wiring lines on films and hybrid integration are included. Three-dimensional integration of films and a temperature sensor label manufactured using hybrid integration process are also elaborated on. Furthermore, key results from fatigue reliability assessment of R2R metallised wiring lines are reported. Finally, some of the challenges in transferring the R2R processes for hybrid integration on film substrates from research labs to industrial manufacturing are highlighted.

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Finite element analysis of uniaxial bending of ultra-thin silicon dies embedded in flexible foil substrates

Cited by 7 publications

References 9 publications

Bending Setups for Reliability Investigation of Flexible Electronics

Bending Setups for Reliability Investigation of Flexible Electronics

Influence of Flexibility of the Interconnects on the Dynamic Bending Reliability of Flexible Hybrid Electronics

Roll-to-roll processing of film substrates for hybrid integrated flexible electronics

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