Finite element analysis of wire clamp for wire bonding

Fan, Dengke; Wang, Fuliang

doi:10.1109/icept-hdp.2012.6474766

Cited by 2 publications

(2 citation statements)

References 2 publications

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“…As a result, it is necessary to develop high performance wire clamps with a novel mechanism and robust controller to provide stable and high speed microelectronic wire bonding. [10,11] . Even if the grasping forces of some clamps were regulated, the grasping force control was mainly carried out in indirect ways, such as through the installation of preload springs or force calibration, making it difficult to achieve real time and precision force control.…”

Section: Introductionmentioning

confidence: 99%

Development of a high speed and precision wire clamp with both position and force regulations

Liang

Wang

Tian

et al. 2017

Robotics and Computer-Integrated Manufacturing

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Development of a high speed and precision wire clamp with both position and force regulations. . Permanent WRAP URL:http://wrap.warwick.ac.uk/94028 Copyright and reuse:The Warwick Research Archive Portal (WRAP) makes this work by researchers of the University of Warwick available open access under the following conditions. Copyright © and all moral rights to the version of the paper presented here belong to the individual author(s) and/or other copyright owners. To the extent reasonable and practicable the material made available in WRAP has been checked for eligibility before being made available.Copies of full items can be used for personal research or study, educational, or not-for-profit purposes without prior permission or charge. Provided that the authors, title and full bibliographic details are credited, a hyperlink and/or URL is given for the original metadata page and the content is not changed in any way.

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Section: Introductionmentioning

confidence: 99%

Development of a high speed and precision wire clamp with both position and force regulations

Liang

Wang

Tian

et al. 2017

Robotics and Computer-Integrated Manufacturing

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show abstract

“…The design of clamps with different specifications has received considerable attention from researchers 10 . Most traditional wire clamps used for wire bonding adopt electromagnetic actuators as drivers 11,12 and complex mechanisms as motion transmission parts. These kinds of clamps show appropriate performance.…”

Section: Introductionmentioning

confidence: 99%

A novel monolithic piezoelectric actuated flexure-mechanism based wire clamp for microelectronic device packaging

Liang

Wang

Tian

et al. 2015

Review of Scientific Instruments

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Placid. (2015) A novel monolithic piezoelectric actuated flexure-mechanism based wire clamp for microelectronic device packaging. Review of Scientific Instruments, 86 (4). 045106. Permanent WRAP url: http://wrap.warwick.ac.uk/76447 Copyright and reuse:The Warwick Research Archive Portal (WRAP) makes this work by researchers of the University of Warwick available open access under the following conditions. Copyright © and all moral rights to the version of the paper presented here belong to the individual author(s) and/or other copyright owners. To the extent reasonable and practicable the material made available in WRAP has been checked for eligibility before being made available.Copies of full items can be used for personal research or study, educational, or not-for profit purposes without prior permission or charge. Provided that the authors, title and full bibliographic details are credited, a hyperlink and/or URL is given for the original metadata page and the content is not changed in any way. Publisher's statement:Copyright ( A note on versions:The version presented here may differ from the published version or, version of record, if you wish to cite this item you are advised to consult the publisher's version. Please see the 'permanent WRAP url' above for details on accessing the published version and note that access may require a subscription.A novel monolithic piezoelectric actuated flexure-mechanism based wire clamp for microelectronic device packaging A novel monolithic piezoelectric actuated wire clamp is presented in this paper to achieve fast, accurate and robust microelectronic device packaging. The wire clamp has compact flexure-based mechanical structure and light weight. To obtain large and robust jaw displacements and ensure parallel jaw grasping, a two-stage amplification composed of a homothetic bridge type mechanism and parallelogram leverage mechanism was designed. Pseudo-rigid-body model (PRBM) and Lagrange approaches were employed to conduct the kinematic, static and dynamic modeling of the wire clamp, and optimization design was carried out. The displacement amplification ratio, maximum allowable stress and natural frequency were calculated. Finite element analysis (FEA) was conducted to evaluate the characteristics of the wire clamp and wire Electro Discharge Machining (EDM) technique was utilized to fabricate the monolithic structure. Experimental tests were carried out to investigate the performance, and the experimental results match well with the theoretical calculation and FEA.The amplification ratio of the clamp is 20.96, and the working mode frequency is 895 Hz.Step response test show the wire clamp has fast response and high accuracy, and the motion resolution is 0.2μm. High speed precision grasping operations of gold and copper wires were realized using the wire clamper.

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Finite element analysis of wire clamp for wire bonding

Cited by 2 publications

References 2 publications

Development of a high speed and precision wire clamp with both position and force regulations

Development of a high speed and precision wire clamp with both position and force regulations

A novel monolithic piezoelectric actuated flexure-mechanism based wire clamp for microelectronic device packaging

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