Finite Element Method Simulation of the Molding Process for Thermal Nano-Imprint Lithography

Abstract

We made a numerical study on the deformation of a viscoelastic polymethyl methacrylene (PMMA) resist when a rigid SiO2 stamp with a rectangular line pattern is imprinted into the PMMA resist for thermal nano-imprint lithography (NIL). The stress distribution in the polymer resist during the molding process is calculated by a finite element method (FEM). Our simulation results reveal that the asymmetric von Mises stress is distributed over the polymer around the external line, which seems to be due to the squeezing flow under the flat space. The stress seems to be concentrated at the sidewall close to the centerline of the whole structure. Our simulation also reveals that a micro gap is formed between the replicated structure and the outer wall of the mold.

Optimization of the profile of the nano-mold and the imprinting conditions by numerical simulation method

“…Lan et al (2009) analyzed the temperature and time dependence of polymer deformation by finite element analysis and predicted the pattern replication after thermal imprint process. Cho et al (2012) calculated the stress distribution in the polymer resist during the molding process and revealed that the asymmetric von Mises stress is distributed over the polymer substrate. Song et al (2008) studied the stress and deformation behavior in polymer resist during the cooling and de-molding process via finite element method.…”