Finite element modeling of curing of epoxy matrix composites

Yan, Xiangqiao

doi:10.1002/app.24337

Cited by 19 publications

(8 citation statements)

References 19 publications

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“…After holding for a period of time, the temperature drops to room temperature T0 at a certain rate K2. The differential equation of this transient heat transfer process is as follows [18][19]…”

Section: Governing Equationsmentioning

confidence: 99%

Numerical study on curing-induced residual stress and deformation of adhesively bonded sandwich structures of dissimilar materials

Zhu

et al. 2022

Int J Adv Manuf Technol

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Adhesively bonded sandwich structure with dissimilar materials becomes an important means of lightweight for the next generation of autobody closure panels. However, during the baking process, the complicated change of physical properties of the adhesive can lead to structural mismatch deformation. In this paper, a multi-physics coupling numerical model of one-component hemming adhesive during the curing process is proposed, to reveal the deformation mechanism of adhesively bonded sandwich structures quantitatively. The material constitutive model of the hemming adhesive is established, considering evolution of curing properties. The curing process of typical aluminum alloy and steel bonded sandwich structure is simulated in COMSOL Multiphysics. The predicted surface deformation of the component is verified by experiment using Digital Image Correlation (DIC) technique, which captures the full-field displacement in a non-intrusive manner. Then, the development process of surface deformation of the outer panel and residual internal stress of the adhesive layer is analyzed, and the influence of temperature cycle on the maximum deformation of the component is discussed. The results show at the beginning of holding stage, the deformed component slightly rebounds, which is related to the chemical shrinkage. Mechanical strain caused by the coefficient of thermal expansion (CTE) and stiffness difference of the inner and outer panels is dominant in the adhesive layer. Reducing the curing rate and maximum holding temperature can reduce the overall deformation of the structure.

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Section: Governing Equationsmentioning

confidence: 99%

Numerical study on curing-induced residual stress and deformation of adhesively bonded sandwich structures of dissimilar materials

Zhu

et al. 2022

Int J Adv Manuf Technol

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“…Owing to the anisotropic property of composite materials and other factors, curing deformation was observed during the molding process of composite parts, which affected their accuracy [1]. To solve this problem, a simulation analysis of the forming process of composite materials was conducted to predict the curing deformation of the parts, and the parameters of the forming process were optimized to effectively improve the forming quality of those parts [2][3][4][5].…”

Section: Introductionmentioning

confidence: 99%

Numerical simulations and optimization of foam filled free-curved surface composite part

Chen

Jing

Xie

et al. 2022

Mater. Res. Express

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The purpose of this study is to predict the curing deformation of a foam-filled free-curved surface composite part and reduce the occurrence of curing deformation through process optimization. This research introduces a finite element simulation method and an optimization method for forming parameters for a foam-filled free-curved surface composite part. Meanwhile, sample manufacturing experiments and a comparative analysis between the simulation and actual objects were conducted. The results showed that finite element simulation analysis could effectively predict the curing deformation of the composite part. After the optimization simulation analysis of the molding process parameters, it was found that the curing deformation of the foam-filled free-curved surface composite part could be as small as 2.30 mm.

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“…For this reason, many efforts have been made to study the curing process and curing deformation. Yan used a two-dimensional finite element model to simulate and analyze the mechanisms pertaining to resin flow, heat transfer, and consolidation of laminated composites [1]. Yang used molecular dynamic simulation to compute thermo-mechanical properties of cross-linked epoxy [2].…”

Section: Introductionmentioning

confidence: 99%

Integrated analysis on cure–microstructure–property–deformation correlation of carbon fiber reinforced resin composites

Wang

Jia

et al. 2015

Computational Materials Science

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Finite element modeling of curing of epoxy matrix composites

Cited by 19 publications

References 19 publications

Numerical study on curing-induced residual stress and deformation of adhesively bonded sandwich structures of dissimilar materials

Numerical study on curing-induced residual stress and deformation of adhesively bonded sandwich structures of dissimilar materials

Numerical simulations and optimization of foam filled free-curved surface composite part

Integrated analysis on cure–microstructure–property–deformation correlation of carbon fiber reinforced resin composites

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