2016
DOI: 10.1088/0957-0233/27/2/025601
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Finite element modelling for the investigation of edge effect in acoustic micro imaging of microelectronic packages

Abstract: In acoustic micro imaging of microelectronic packages, edge effect is often presented as artifacts of C-scan images, which may potentially obscure the detection of defects such as cracks and voids in the solder joints. The cause of edge effect is debatable. In this paper, a two-dimensional finite element model is developed on the basis of acoustic micro imaging of a flip-chip package using a 230 MHz focused transducer to investigate acoustic propagation inside the package in attempt to elucidate the fundamenta… Show more

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Cited by 5 publications
(5 citation statements)
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“…In this paper, we develop finite element models to emulate the microdefect detection process by using COMSOL Multiphysics coupling software, and further calculated the acoustic propagation map for analyzing the acoustic energy transmission. According to the C-lines [21] and the C-scans together with the maps, we reveal the acoustic interaction behavior and clarify the edge blurring effect. The simulation results are verified by experiments.…”
Section: Introductionmentioning
confidence: 95%
See 2 more Smart Citations
“…In this paper, we develop finite element models to emulate the microdefect detection process by using COMSOL Multiphysics coupling software, and further calculated the acoustic propagation map for analyzing the acoustic energy transmission. According to the C-lines [21] and the C-scans together with the maps, we reveal the acoustic interaction behavior and clarify the edge blurring effect. The simulation results are verified by experiments.…”
Section: Introductionmentioning
confidence: 95%
“…This blurring seriously affects the detection precision of micron-scale defects. As microelectronic devices trend to miniaturization [16], [20], the characteristics of high density and fine pitch of flip chips result in smaller-scale defects, and the edge effect becomes more significant [21]. Therefore, it is necessary to study the edge effect of microdefects in the AMI.…”
Section: Introductionmentioning
confidence: 99%
See 1 more Smart Citation
“…The finite element model is developed with the commercial software (COMSOL Multiphysics 5.2), as shown in Figure 1. To overcome the huge computational resource requirements [20,21,22,23], we design a virtual transducer (VT) by reducing the size of the physical transducer (1/20 of the physical transducer) in the model, as shown in Figure 1a. The sizes of the coupling water zone and the thickness of the sample are also reduced.…”
Section: Point Spread Function (Psf)mentioning
confidence: 99%
“…It is hard to measure the PSF directly for high frequency transducer in AMI. Zhang et al developed a 2D AMI finite element model of a flip-chip package to investigate the acoustic propagation inside the package [20,21,22,23], while sparse reconstruction and super resolution were not involved.…”
Section: Introductionmentioning
confidence: 99%