First Demonstration of Panel Glass Fan-Out (GFO) Packages for High I/O Density and High Frequency Multi-chip Integration

Shi, Tailong; Buch, Chintan; Smet, Vanessa; Sato, Yoichiro; Parthier, L.; Wei, Frank; Lee, Cody; Tummala, Rao

doi:10.1109/ectc.2017.287

Cited by 13 publications

(1 citation statement)

References 6 publications

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“…By contrast, current silicon interposers and mold compound embedded packages are not able to compete in terms of I/O pitch, bandwidth, and reliably owing to thermo-compression bonding assembly and die shift induced limits [19]. More recently, several 3D glassbased package architectures for HPC applications have been demonstrated in [80], [81], [82]. The advanced 3D package concept as illustrated in Fig.…”

Section: Packaging and Interposer Solutionsmentioning

confidence: 99%

RF Glass Technology Is Going Mainstream: Review and Future Applications

Chaloun¹,

Brandl²,

Ambrosius³

et al. 2023

IEEE J. Microw.

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Driven by the increasing demand for high-throughput communication links and high-resolution radar sensors, the development of future wireless systems pushes at ever greater operating frequencies. By analogy, high-performance computing (HPC) systems with high-bandwidth I/Os have become a mainstream solution to address multi Gbit/s data rates. Heterogeneous integration technologies play a vital role here in enhancing the performance and functional density, along with reducing the size and costs of such RF systems. In line with this trend, many passive components, which have once been monolithically integrated, are now implemented on ceramic or polymer-based packages. Besides these long-established material and process technologies, considerable efforts have also recently been devoted to the development of RF components on glass and glass-ceramics. Spurred by their low dielectric losses, extremely smooth surfaces, and excellent dimensional stability, glass technologies are emerging as a promising alternative for high-volume and high-performance RF applications. In this article, relevant glass materials and key enabling technologies are reviewed and put into context with well-established RF substrate technologies. Another focus is set on the latest glass-based packaging and interposer solutions ranging from MHz-to-THz frequencies. To showcase the development activities and practical accomplishments of the RF glass technology, also a large variety of key components is presented. Finally, the paper concludes by discussing future research and development directions of RF glass devices.INDEX TERMS MTT 70th Anniversary Special Issue, glass technology, dielectrics, packaging, interposer, system-on-package, interconnects, filters, antennas, antenna-in-package, millimeter wave (mm-wave).

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