2022
DOI: 10.1103/physrevmaterials.6.096001
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First-principles investigation of CuO decomposition and its transformation into Cu2O

Abstract: This paper reports on the mechanisms of CuO decomposition and its associated phase transformation into Cu2O, as a fundamental step of thermite materials reaction, where CuO serves as the oxidizer. Frenkel pair defects in perfect bulk CuO show extremely high formation energy (>4 eV) indicating that its decomposition initiates at defects/interfaces/surfaces, the latter being sensitive to surface orientation. In contrast to a variety of CuO surfaces ((111), ( 110), (101 ̅ )) exhibiting three-fold coordinated oxyg… Show more

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Cited by 11 publications
(10 citation statements)
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“…Similarly, for Cu-Cu interatomic distance characteristic of bulk CuO at 200 K, a redistribution of copper atoms of the top CuO layer is taking place resulting in a significant reduction of the distance from ~3 to 2.6 Å. This process is relatively similar to the reconstruction of the CuO(001) free surface observed using DFT calculations, for which the well aligned Cu top surface layer splits in the direction perpendicular to the surface 43 . Careful visualization of the CuO/TiOx interface structure allows following this splitting process, which is partial at 500 K (Figure 2b), and continuously progresses to end up with the splitting of the full Cu monolayer into two Cu layers at 900 K (Figure 2d).…”
Section: Cuo Decomposition Starting At 600 Kmentioning
confidence: 56%
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“…Similarly, for Cu-Cu interatomic distance characteristic of bulk CuO at 200 K, a redistribution of copper atoms of the top CuO layer is taking place resulting in a significant reduction of the distance from ~3 to 2.6 Å. This process is relatively similar to the reconstruction of the CuO(001) free surface observed using DFT calculations, for which the well aligned Cu top surface layer splits in the direction perpendicular to the surface 43 . Careful visualization of the CuO/TiOx interface structure allows following this splitting process, which is partial at 500 K (Figure 2b), and continuously progresses to end up with the splitting of the full Cu monolayer into two Cu layers at 900 K (Figure 2d).…”
Section: Cuo Decomposition Starting At 600 Kmentioning
confidence: 56%
“…This process is relatively similar to the reconstruction of the CuO(001) free surface observed using DFT calculations, for which the well aligned Cu top surface layer splits in the direction perpendicular to the surface. 43 Careful visualization of the CuO/TiO x interface structure allows following this splitting process, which is partial at 500 K (Fig. 2b), and continuously progresses to end up with the splitting of the full Cu monolayer into two Cu layers at 900 K (Fig.…”
Section: Resultsmentioning
confidence: 99%
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