Fixed abrasive diamond wire machining—part II: experiment design and results

Clark, W. I.; Shih, Albert J.; Lemaster, Richard L.; McSpadden, S.B.

doi:10.1016/s0890-6955(02)00216-x

Cited by 73 publications

(27 citation statements)

References 4 publications

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“…[1][2][3] Moller 4 stated that the wire saw process is responsible for 30% of the total silicon wafer-production cost, which directly affects industry. There is a need to optimize the process by developing models relating process parameters to product quality and process efficiency measures.…”

Section: Introductionmentioning

confidence: 99%

“…5 Parametric studies relating process parameters to forces, and surface roughness and wire wear for cutting foam ceramics and wood were conducted by Clark et al. 2 Hardin et al 11 conducted a parametric study for slicing single crystal SiC with a fixed-abrasive diamond wire, relating wire speed, rocking frequency, and downfeed rate with surface and subsurface damage. Closed-loop diamond-impregnated wire saw cutting of Al 2 O 3 and TiC ceramics was studied by Meng et al 12 Hardness anisotropy of Lithium Niobate wafers has been investigated using nano-indentation.…”

Section: Introductionmentioning

confidence: 99%

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Roughness damage evolution due to wire saw process

Teomete

2011

Int. J. Precis. Eng. Manuf.

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The wire saw process is widely used for silicon wafer production with high yield and low surface damage in solar cell and microelectronics industries. The wire saw process is used to machine brittle materials in the ductile regime where high yield and low surface damage are desired. The wire saw process is also used to cut concrete and rocks in civil engineering. In this study, an experimental parametric study was conducted by varying process parameters to determine surface roughness damage. Ductile regime material removal by trans-granular failure and brittle fracture by inter-granular failure are observed in electron micrographs of the cut surfaces. A damage model that relates the roughness damage to process parameters was derived. The damage model predicts the roughness damage satisfactorily. The model shows that the roughness damage is proportional to the ratio of feed speed to wire speed. Improvement in the efficiency of the process without increasing the roughness damage can be attained by increasing the feed speed proportionally to wire speed. Wire tension does not affect roughness damage. Roughness damage, however, is affected by properties of the wire. Wires having smaller grit radius and small grit spacing cause less roughness damage.

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Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

Roughness damage evolution due to wire saw process

Teomete

2011

Int. J. Precis. Eng. Manuf.

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“…Taip pat buvo pasirinktas pastovus svyravimo judesių intervalas vielai pjaunant nuo nulio iki dviejų laipsnių ir pastovus jo keitimosi greitis (5 pav.) (Clark et al 2003a(Clark et al , 2003b. Keičiama buvo tik vertikalaus rėmo pastūma F (6 pav.).…”

Section: Tyrimų Stendas Medžiagos Ir Metodikaunclassified

Research on Cutting Crystals Soluble in Water / Vandenyje Tirpių Kristalų Pjaustymo Tyrimai

Vilkelis

Jurevičius

2015

Mokslas – Lietuvos Ateitis

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Vaizdų technologijos T 111 Image Technologies T 1112014 © Straipsnio autoriai. Leidėjas VGTU leidykla "Technika". Šis straipsnis yra atvirosios prieigos straipsnis, turintis Kūrybinių bendrijų (Creative Commons) licenciją (CC BY-NC 4.0), kuri leidžia neribotą straipsnio ar jo dalių panaudą su privaloma sąlyga nurodyti autorių ir pirminį šaltinį. Straipsnis ar jo dalys negali būti naudojami komerciniams tikslams. MOKSLAS -LIETUVOS ATEITIS SCIENCE -FUTURE OF LITHUANIA ĮvadasTobulėjant kietųjų medžiagų apdirbimo technologiniams procesams, atsiranda vis daugiau galimybių atlikti tam tikrus pjovimo procesus (nuo atpjovimo iki baigiamojo apdirbimo), kurių anksčiau atlikti nebuvo galimybių. Ankstesniame tyrime, naudojant modernias deimantinės vielos pjaustymo stakles "RTS 440", buvo bandoma atpjauti ypač kietas medžiagas (kristalus), tokias kaip safyras, kvarcas, granatas, kurias atpjauti yra labai sunku, o kai kuriais atvejais visai neįmanoma. Tačiau apdirbant lazerinėje technikoje naudojamus kristalus taip pat susiduriama su kita problema -nemaža dalis lazerinėje technikoje naudojamų kristalų yra tirpūs vandenyje.Daugeliu atvejų, pjaunant kristalus, aušinti naudojamas skystis yra sudarytas iš įvairių emulsiklių ar lubrikantų, kurių pagrindą sudaro vanduo. Todėl pjaunant vandenyje tirpius kristalus ir aušinti naudojant skystį, kurio pagrindas yra vanduo, kristalai paprasčiausiai pradėtų tirpti, todėl, pjaunant tokius kristalus, reikalingos specifinės aušinimo priemonės arba atpjovimo būdai (Semibratov et al. 1978).Pjaunant deimantine viela vandenyje tirpius kristalus, aušinti galima naudoti ne vandens pagrindu sudarytus skysčius, todėl pjovimo technologija nesikeičia nepriklausomai nuo to, kokios prigimties (ar ypač kietas, ar tirpus vandenyje) kristalas yra pjaunamas, deimantinės vielos pjovimo privalumai išlieka tokie patys. Todėl tai nedaro įtakos pjaunamo kristalo atpjovimo konstrukcijai, tai yra deimantine viela be didesnių problemų galima atpjauti sudėtingos geometrinės formos detales (Hardin 2003).Todėl šiame darbe buvo atliekamas tyrimas, kurio metu deimantinės vielos pjaustymo staklėmis buvo pjaustomas vandenyje tirpus kristalas KDP, siekiant nustatyti KDP paviršiaus vidutinio aritmetinio profilio nuokrypio Ra pastūmos priklausomybę. Tyrimų stendas, medžiagos ir metodikaKDP kristalas buvo pjaustomas stendu, kurio pagrindas yra deimantinės vielos pjaustymo staklės "RTS 440" (1 pav.) su papildoma aušinimo sistema.

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“…The cutting speed is 11.5 m/s. Clark et al [37] report that a fixed abrasive sawing wire (SW), with 250 lm nominal diameter, is very effective for cutting ceramic foams, i.e. the brittle ceramic struts are left intact.…”

Section: Sample Preparationmentioning

confidence: 99%

Assessing the influence of four cutting methods on the thermal contact resistance of open-cell aluminum foam

Jaeger

T’Joen

Huisseune

et al. 2012

International Journal of Heat and Mass Transfer

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a b s t r a c tThe application of open-cell aluminum foam often involves a cutting operation to the desired shape and dimensions. Depending on the applied cutting method, this operation can result in a significantly different contact surface area between the foam and a substrate, and a substantial plastic deformation of the struts near the cutting plane. Both are characterised for four cutting methods: circular saw, band saw, sawing wire and electron discharge machining. The first two methods result in a significant local compression. No compression is observed with the other two methods. However, the eroding nature of electron discharge machining results in blunt strut-ends which minimise the contact surface area. The highest contact surface area is obtained with a sawing wire cut.The thermal contact resistance is deduced from experimental data obtained from a press-fit bonding with 0.5 MPa pressure between foam and substrate. Data analysis is done via a conventional zeroth-order thermal resistance model. The highest thermal contact resistance is found for a sample cut with a circular saw. Cutting with band saw reduces this with 25%, electron discharge machining yields a reduction of 36% and sawing wire results in 64% reduction of the press-fit thermal contact resistance.

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Fixed abrasive diamond wire machining—part II: experiment design and results

Cited by 73 publications

References 4 publications

Roughness damage evolution due to wire saw process

Roughness damage evolution due to wire saw process

Research on Cutting Crystals Soluble in Water / Vandenyje Tirpių Kristalų Pjaustymo Tyrimai

Assessing the influence of four cutting methods on the thermal contact resistance of open-cell aluminum foam

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