Flame Retardant Epoxy Resins Containing Bisaryl Diphosphates Oligomer

Abstract

Bisphenol A bis( diphenyl phosphate) oligomer (BDP) as flame retardants (FR) was synthesized, whose structure was characterized by IR. 30% weight BDP was doped into epoxy resins (EP) to get 26.2 % of LOI and UL 94 V-0. The degradation behavior of EP containing BDP was studied by TG, SEM and cone calorimeter. In the thermal degradation of EP containing BDP, the initial decomposition temperature, Tm and heat release and smoke production are decreased while Rmax, char yields, and inherent thermal stability are increased. Surface of the char is dense and compact, which can isolate the transfer of mass and heat between the materials and the flame to protect the unburned materials.

The application of organophosphorus flame‐retardants in epoxy resin

“…Phosphorus flame‐retardants have been used to efficiently inhibit and improve the thermal properties of EP, especially for use in the electrical, electronic, and aerospace industries . They include the following: red phosphorus and ammonium polyphosphate (both free and encapsulated), 9,10‐dihydro‐9‐oxa‐10‐phosphaphenanthrene‐10‐oxide and its derivatives , phosphate esters , phosphonate‐melamine compounds , silicon/phosphorus hybrids , phosphonate esters , salts of alkylphosphinic or alkylphosphonic acids , and nanocomposites .…”