Flexible and stretchable thermoelectric devices with Ni-EGaIn liquid metal electrodes for cooling and low-grade-body heat harvesting

Xu, Yunhe; Wu, Bo; Hou, Chengyi; Li, Yaogang; Wang, Hongzhi; Zhang, Qinghong

doi:10.1016/j.jallcom.2023.169260

Cited by 10 publications

(4 citation statements)

References 37 publications

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“…Liquid metal is often mentioned as an interesting and promising material that can maintain stable conductivity with a very low modulus. ,,,,,,− Compared to metals with a modulus of GPa, the modulus of a liquid state of a metal can be regarded as near zero. Representative materials include Ga and Ga-based EGaIn and Gallium–Indium–Tin alloys (Gallinstan), − which can maintain conductive liquid properties at room temperature. In addition, due to its nature, a liquid does not require a specific shape or structure to reduce stress.…”

Section: Strain-compliance With Lowering Effective Moduli Of Material...mentioning

confidence: 99%

Materials and Structural Designs toward Motion Artifact-Free Bioelectronics

Park,

Jeong,

et al. 2024

Chem. Rev.

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Bioelectronics encompassing electronic components and circuits for accessing human information play a vital role in real-time and continuous monitoring of biophysiological signals of electrophysiology, mechanical physiology, and electrochemical physiology. However, mechanical noise, particularly motion artifacts, poses a significant challenge in accurately detecting and analyzing target signals. While software-based "postprocessing" methods and signal filtering techniques have been widely employed, challenges such as signal distortion, major requirement of accurate models for classification, power consumption, and data delay inevitably persist. This review presents an overview of noise reduction strategies in bioelectronics, focusing on reducing motion artifacts and improving the signal-to-noise ratio through hardware-based approaches such as "preprocessing". One of the main stress-avoiding strategies is reducing elastic mechanical energies applied to bioelectronics to prevent stress-induced motion artifacts. Various approaches including strain-compliance, strain-resistance, and stress-damping techniques using unique materials and structures have been explored. Future research should optimize materials and structure designs, establish stable processes and measurement methods, and develop techniques for selectively separating and processing overlapping noises. Ultimately, these advancements will contribute to the development of more reliable and effective bioelectronics for healthcare monitoring and diagnostics.

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Section: Strain-compliance With Lowering Effective Moduli Of Material...mentioning

confidence: 99%

Materials and Structural Designs toward Motion Artifact-Free Bioelectronics

Park,

Jeong,

et al. 2024

Chem. Rev.

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“…1(d) and Table S1 (ESI †). 15,[28][29][30][31][32][33][34][35][36][37][38][39] Our work has demonstrated high performance in power generation. Moreover, the normalized power density, which is used to evaluate the inherent power generation ability of the power density divided by DT 2 by excluding the dependency of DT, is obtained as 3.60 mW cm À2 K À2 .…”

Section: Power Generation Performance Of the F-tedmentioning

confidence: 99%

High-performance flexible thermoelectric devices with a copper foam heatsink for personal thermal management

Zhou,

Pang,

Zhang

et al. 2024

J. Mater. Chem. C

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“…Liquid metals such as eutectic Gallium and Indium (eGaIn) and gallinstan have been used for flexible electronics; utilizing liquid metal for its roles as an electrode and achieving a 30 % stretchability, [22] Moreover, there have been studies aimed at mitigating the breakdown of liquid metal channels by incorporating copper particles into the liquid metal. [23] However, to the best of our knowledge, previous thermoelectric devices using liquid metals had low cooling performance (⩽ 10 °C) [24] and stretchability (20-30%).…”

Section: Doi: 101002/admt202301171mentioning

confidence: 99%

A Stretchable Thermoelectric Device based on Direct Ink Writing of Liquid Metal and Multi‐Layer Lamination

Kim,

Bae

2024

Adv Materials Technologies

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Wearable thermoelectric devices are widely used due to their ability to generate heat and cool rapidly without the need for bulky external equipment. Researchers have explored methods to enhance flexibility and stretchability by incorporating liquid metal as an electrode. However, the challenge lies in the low thermal conductivity of the polymer, which hampers heating and cooling performance. Traditional methods, like molding and spraying, increase the thickness of both liquid metal and polymer channels, but this added thickness does not significantly improve the device's stretchability.[1, 2] To overcome these issues, this paper proposes a stretchable thermoelectric device (STED), which offers improved heating and cooling capabilities, as well as enhanced stretchability. To enhance the thermal conductivity of the polymer, Ag powder with varying particle sizes is mixed with the material. Additionally, the liquid metal is deposited using the direct ink writing (DIW) method, reducing the whole thickness of STED. The air layer is created by printing molten isomalt, which is subsequently removed using water. The proposed STED exhibits high stretchability, reaching up to 150 %, enabling flexible twisting in various directions. The double‐layer structure resulted in a maximum temperature decrease of 14 °C at room temperature.

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Flexible and stretchable thermoelectric devices with Ni-EGaIn liquid metal electrodes for cooling and low-grade-body heat harvesting

Cited by 10 publications

References 37 publications

Materials and Structural Designs toward Motion Artifact-Free Bioelectronics

Materials and Structural Designs toward Motion Artifact-Free Bioelectronics

High-performance flexible thermoelectric devices with a copper foam heatsink for personal thermal management

A Stretchable Thermoelectric Device based on Direct Ink Writing of Liquid Metal and Multi‐Layer Lamination

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