2020
DOI: 10.1063/1.5139494
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Flexible BSA MIM capacitor with negative voltage coefficient for RF applications

Abstract: In this report, Bovine Serum Albumin-based Metal–Insulator–Metal structures on Indium doped Tin Oxide coated flexible Polyethylene Terephthalate substrates with Aluminum (Al) as the top electrode have been fabricated and studied in detail. The thickness of the film was measured using a Field Emission Scanning Electron Microscope. The Fourier Transform Infrared Attenuated Total Reflectance spectrum confirms the presence of both amide-I and amide-II in the protein film. Ultraviolet-Visible Spectroscopy was perfo… Show more

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Cited by 8 publications
(5 citation statements)
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“…The CV characteristics show frequency dispersion, which is similar to the nature observed in general MIM structures. 73 The leakage current density of the device is shown in the inset of Figure 6(e). A leakage current density of 1.15 μA/cm 2 at 1 V was observed, which facilitated a good contact formation on the substrate.…”
Section: ■ Results and Discussionmentioning
confidence: 99%
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“…The CV characteristics show frequency dispersion, which is similar to the nature observed in general MIM structures. 73 The leakage current density of the device is shown in the inset of Figure 6(e). A leakage current density of 1.15 μA/cm 2 at 1 V was observed, which facilitated a good contact formation on the substrate.…”
Section: ■ Results and Discussionmentioning
confidence: 99%
“…However, at high frequencies, the capacitance and conductance values are close to the ideal values, as the traps fail to follow the AC signal at high frequencies. Table 4 compares the electrical properties of the BSA-based MIM structure fabricated on PET/ITO 73 with the MIM device fabricated on BPS.…”
Section: ■ Results and Discussionmentioning
confidence: 99%
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“…In recent years, MIM capacitors have been widely applied in various electronics, such as dynamic random-access memory (DRAM), flexible electronics [1], super-capacitor, and micro-electro-mechanical systems (MEMS) resonators [2]. In order to meet the miniaturization and high integration of devices, a higher capacitance density is required [2,3].…”
Section: Introductionmentioning
confidence: 99%