2023
DOI: 10.3390/s23042136
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Flexible Film Bulk Acoustic Resonator Based on Low-Porosity β-Phase P(VDF-TrFE) Film for Human Vital Signs Monitoring

Abstract: P(VDF-TrFE) is a promising material for flexible acoustic devices owing to its good piezoelectric performance and excellent stretchability. However, the high density of internal pores and large surface roughness of the conventional P(VDF-TrFE) results in a high propagation attenuation for acoustic waves, which limits its use in flexible acoustic devices. In this paper, a novel method based on two-step annealing is proposed to effectively remove the pores inside the P(VDF-TrFE) film and reduce its surface rough… Show more

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Cited by 5 publications
(2 citation statements)
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“…Gold nanoparticles were coated using an ion sputtering instrument (KYKY SBC-12, Beijing, China ), and the surface morphology and cross-section were measured using field emission scanning electron microscopy (FE-SEM) (Hitachi SU5000, Marunouchi 1-chome, In our previous work, an approach involving two-step annealing and surface etching was employed to effectively eliminate pores within P(VDF-TrFE) films and reduce surface roughness [15]. Since the annealing process has significant influences on P(VDF-TrFE) properties, including the content of β-phase, piezoelectric coefficient, and porosity, a novel three-step annealing process (sample S1) has been developed in this work, achieving good flatness and high density without the need for surface etching and simplifying the fabrication process.…”
Section: Characterization Of P(vdf-trfe) Thin Filmsmentioning
confidence: 99%
“…Gold nanoparticles were coated using an ion sputtering instrument (KYKY SBC-12, Beijing, China ), and the surface morphology and cross-section were measured using field emission scanning electron microscopy (FE-SEM) (Hitachi SU5000, Marunouchi 1-chome, In our previous work, an approach involving two-step annealing and surface etching was employed to effectively eliminate pores within P(VDF-TrFE) films and reduce surface roughness [15]. Since the annealing process has significant influences on P(VDF-TrFE) properties, including the content of β-phase, piezoelectric coefficient, and porosity, a novel three-step annealing process (sample S1) has been developed in this work, achieving good flatness and high density without the need for surface etching and simplifying the fabrication process.…”
Section: Characterization Of P(vdf-trfe) Thin Filmsmentioning
confidence: 99%
“…System-on-chip (SoC) technology, which combines multiple functionalities on a single chip, offers a potential solution for reducing the system area and mitigating insertion losses. Additionally, three-dimensional (3D) integration techniques provide a means of vertically stacking multiple layers of RF components, thereby further reducing the overall system footprint [13][14][15].…”
Section: Introductionmentioning
confidence: 99%