2015
DOI: 10.1002/adma.201501856
|View full text |Cite
|
Sign up to set email alerts
|

Flexible Lamination Encapsulation

Abstract: A novel flexible encapsulation method (Flex Lami-capsulation) is reported, which can be applied in the roll-to-roll process for mass production of organic electronic devices. Flex Lami-capsulation is very simple, fast, and getter-free, and is as effective as glass encapsulation. Use of this method is feasible in large-area flexible displays and does not have the drawbacks of conventional encapsulation methods.

Help me understand this report

Search citation statements

Order By: Relevance

Paper Sections

Select...
3
1
1

Citation Types

0
37
0

Year Published

2015
2015
2024
2024

Publication Types

Select...
10

Relationship

1
9

Authors

Journals

citations
Cited by 69 publications
(37 citation statements)
references
References 76 publications
0
37
0
Order By: Relevance
“…Despite this, most existing studies have focused their investigations on barrier properties, and external mechanical stress. [4,5] The aim of our current study was to design a zerostress thin-film encapsulation method which could enhance the intrinsic stability of the entire system. We especially focused on the residual stress produced by the encapsulation process to gain a better understanding of its effect on the intrinsic stability of the device.…”
Section: Introductionmentioning
confidence: 99%
“…Despite this, most existing studies have focused their investigations on barrier properties, and external mechanical stress. [4,5] The aim of our current study was to design a zerostress thin-film encapsulation method which could enhance the intrinsic stability of the entire system. We especially focused on the residual stress produced by the encapsulation process to gain a better understanding of its effect on the intrinsic stability of the device.…”
Section: Introductionmentioning
confidence: 99%
“…However, the drawback of both organic–inorganic alternating barrier and ALD is low production throughput. To overcome this problem, flexible lamination with metal foil and PDMS encapsulation process including treatment with a self‐assembled monolayer, spin coating, and thermal cross‐linking has been reported ( Figure ) . The water vapor transmission rate (WVTR) measurement proved that the flexible lamination encapsulation has the excellent ability to block the moisture and oxygen.…”
Section: Fundamental Elements Of Foledsmentioning
confidence: 99%
“…80,81 The advantages of the ALD method are fine control of film thickness and reaction cycle, thus ALD can yield uniform and reproducible films. 88 Flex Lami-capsulation shows a comparable property to the glass encapsulation, high flexibility with minimum bending radius of 6 mm, and a scalability. A thin Al 2 O 3 layer with a high barrier property [WVTR < 10 −5 g∕ðm 2 · dÞ] has been deposited by ALD on a polymer substrate.…”
Section: Flexible Encapsulationmentioning
confidence: 99%