2014
DOI: 10.1002/adma.201403481
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Flexible Low‐Voltage Organic Complementary Circuits: Finding the Optimum Combination of Semiconductors and Monolayer Gate Dielectrics

Abstract: Low-voltage p-channel and n-channel organic transistors with channel lengths down to 0.5 μm using four small-molecule semiconductors and ultra-thin dielectrics based on two different phosphonic acid monolayers are fabricated on plastic substrates and studied in terms of effective mobility, intrinsic mobility and contact resistance. For the optimum materials combination, flexible complementary circuits have signal delays of 3.1 μs at 5 V.

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Cited by 112 publications
(88 citation statements)
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“…[ 38 ] Furthermore, for the samples with a stamp printed OTS layer, the higher mobility is even comparable to that of DNTT deposited onto a substrate at 60 °C (optimal temperature for vacuum deposited thin fi lms of DNTT that have the highest mobility). [38][39][40] These fi ndings allow us to benchmark the effectiveness of our method that uses paraffi n in stamping and directly prove its potential application in the fabrication of organic electronic devices. In order to further clarify the function of paraffi n stamping in the deposition of SAMs, we also used a control, by using the same treatment procedure on the SAMs without the paraffi n stamp but instead just dropped 20 µL of SAM solution onto the substrate and undergoing the same vapor phase treatment with HCl, thermal annealing, and ultrasonication.…”
Section: Resultsmentioning
confidence: 97%
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“…[ 38 ] Furthermore, for the samples with a stamp printed OTS layer, the higher mobility is even comparable to that of DNTT deposited onto a substrate at 60 °C (optimal temperature for vacuum deposited thin fi lms of DNTT that have the highest mobility). [38][39][40] These fi ndings allow us to benchmark the effectiveness of our method that uses paraffi n in stamping and directly prove its potential application in the fabrication of organic electronic devices. In order to further clarify the function of paraffi n stamping in the deposition of SAMs, we also used a control, by using the same treatment procedure on the SAMs without the paraffi n stamp but instead just dropped 20 µL of SAM solution onto the substrate and undergoing the same vapor phase treatment with HCl, thermal annealing, and ultrasonication.…”
Section: Resultsmentioning
confidence: 97%
“…This is particularly important for the complementary circuits that are integrated with p-channel and n-channel transistors. [ 31,40,53 ] Since previous paraffi n wax is not suitable to print the SAMs with the tail groups of fl uoroalkyl chains, we further modify the contents of the paraffi n wax by blending with micronized polytetrafl uoroethylene (PTFE)-modifi ed polyethylene wax (see Figure S6, Supporting Information). C8-PFTS was printed onto SiO2, and C8-PFPA was used onto AlO x respectively.…”
Section: Resultsmentioning
confidence: 99%
“…A fundamental limitation of the dipping method is that it usually covers the entire substrate with the same SAM, making it difficult to create a dense pattern of more than one type of SAM on the same substrate. However, for certain applications, such as complementary circuits based on p-channel and n-channel organic TFTs that benefit from different gate-oxide modifications for each type of TFT [19], it is beneficial to be able to pattern more than one type of SAM on the same substrate. This will require the spatially resolved formation of each SAM on the substrate, which can be accomplished, for example, by microcontact printing [20][21][22][23], microwriting [24], lithography with ultraviolet radiation [25], or combinations thereof [26].…”
Section: Introductionmentioning
confidence: 99%
“…[1][2][3][4][5][6][7][8] Low-voltage operation of OFETs is crucial to realize organic-based products driven by batteries or wireless power sources, and the current strategies include improving the fi eld-effect mobility ( µ FE ) and/ or employing a dielectric layer with large capacitance per unit area ( C i ) in OFETs. [9][10][11] The former faces the challenge of a fundamental limit in µ FE arising from the relatively weak intermolecular interaction in organic active layers, and accordingly the latter is more often adopted. According to C i = k / d , where k and d are the dielectric constant and thickness of the dielectric layer in OFETs, respectively, typical approach to get large C…”
mentioning
confidence: 99%