Flip chip assemblies using gold bumps and adhesive

Zhong, Zhang

doi:10.1108/13565360110405884

Cited by 14 publications

(2 citation statements)

References 2 publications

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“…Anisotropic conductive films (ACFs) consist of a thermoset polymer matrix mixed with conducting particles such as Ni or Ni/Au-coated polymer balls [11,12]. The electrical interconnection is established through the conducting particles that are trapped between the contact pads and the conductors on the PCB, see figure 6.…”

Section: Flip Chip Bonding Using An Anisotropic Conductive Filmmentioning

confidence: 99%

SU-8 cantilever chip interconnection

Johansson

Janting

Schultz

et al. 2006

J. Micromech. Microeng.

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The polymer SU-8 is becoming widely used for all kinds of micromechanical and microfluidic devices, not only as a photoresist but also as the constitutional material of the devices. Many of these polymeric devices need to include a microfluidic system as well as electrical connection from the electrodes on the SU-8 chip to a printed circuit board. Here, we present two different methods of electrically connecting an SU-8 chip, which contains a microfluidic network and free-hanging mechanical parts. The tested electrical interconnection techniques are flip chip bonding using underfill or flip chip bonding using an anisotropic conductive film (ACF). These are both widely used in the Si industry and might also be used for the large scale interconnection of SU-8 chips. The SU-8 chip, to which the interconnections are made, has a microfluidic channel with integrated micrometer-sized cantilevers that can be used for label-free biochemical detection. All the bonding tests are compared with results obtained using similar Si chips. It is found that it is significantly more complicated to interconnect SU-8 than Si cantilever chips primarily due to the softness of SU-8.

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Section: Flip Chip Bonding Using An Anisotropic Conductive Filmmentioning

confidence: 99%

SU-8 cantilever chip interconnection

Johansson

Janting

Schultz

et al. 2006

J. Micromech. Microeng.

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show abstract

“…smaller device footprints, and lower profiles compared with wire bonding technology [1][2][3][4][5][6].…”

mentioning

confidence: 99%

Deformations of a simplified flip chip structure under thermal testing inspected using a real-time Moiré technique

Zhong

Wong

Shi

2005

Int J Adv Manuf Technol

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Deformations of a Si-epoxy-FR4 (simplified flip chip) structure under thermal testing were inspected with a real-time Moiré technique. Specimens without cracks and specimens with a crack at the silicon-epoxy interface were prepared. The measurement results showed that the maximum deformation appeared at the edge. When the specimen was cooled to 20 • C, there was residual plastic deformation in the specimen. The creep effect was more dominant in the FR4-epoxy interface. Upon cooling to 20 • C, the specimen experienced partial strain recovery. To characterize the behavior of the interfacial crack, stress intensity factors K I and K II , and the strain energy release rate G in the vicinity of the crack tip were calculated using the measured deformations to conduct a quantitative study. It was observed that a sharp strain gradient occurred at the crack tip. K I and K II were dependent on temperature, and G was dominated by K I for the interfacial crack in the specimen.

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Introduction

Lu²,

Wong

2009

Electrical Conductive Adhesives With Nanotechnologies

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Flip chip assemblies using gold bumps and adhesive

Cited by 14 publications

References 2 publications

SU-8 cantilever chip interconnection

SU-8 cantilever chip interconnection

Deformations of a simplified flip chip structure under thermal testing inspected using a real-time Moiré technique

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