Flip Chip Bonding

Chhabra, K.C.; Gupta, D.; Arora, O. P.

doi:10.1080/03772063.1975.11450709

Cited by 3 publications

(2 citation statements)

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“…Without aliphatic diacids, the wettability of DGEBA (reference sample) was extremely poor, indicating no wetted solder balls (Figs (c), (d)). The commercialized chip/substrate set was used for flip‐chip bonding (Scheme ), which is the most widely used thermocompression process for attaching a chip and a substrate in semiconductor packaging . The SAC305 solder cap was completely wetted between the Cu pillar and the Cu pad (Fig.…”

Section: Resultsmentioning

confidence: 99%

Crosslinkable deoxidizing hybrid adhesive of epoxy–diacid for electrical interconnections in semiconductor packaging

Jang

Eom

Choi

et al. 2018

Polymer International

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For electrical interconnections in semiconductor packaging, epoxy-based pastes have recently attracted considerable interest due to their excellent adhesion to various substrates and their reasonable electrical and mechanical properties, especially when combined with deoxidizing agents (to remove metallic oxides). Here, epoxy-diacid-based hybrid pastes were examined to achieve a deoxidizing capability for eliminating Sn-based solder oxides and adhesion between microchip and substrate as a one-step process. Onset, exothermic peak and end temperatures of the reaction between epoxy and diacids were systematically probed using DSC, rheometry and Fourier transform infrared (FTIR) spectroscopy. The last moment of the adhesive reaction during heating substantially enhanced the thermal and mechanical properties of the epoxy-diacid adhesive despite the absence of exothermic enthalpy detected by DSC. The glass transition temperature (T g ) and Young's modulus gradually decreased as a function of aliphatic chain length of diacids except when the length was extremely short and voids were produced. Soldering (wetting) and deoxidizing capabilities of the hybrid adhesive were observed via optical microscopy and FTIR. The correlation between the reaction, T g , conversion and viscosity was also investigated. Lastly, complete wetting and electrical interconnection with good mechanical robustness were achieved for a commercial chip/substrate set by flip-chip bonding.

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Section: Resultsmentioning

confidence: 99%

Crosslinkable deoxidizing hybrid adhesive of epoxy–diacid for electrical interconnections in semiconductor packaging

Jang

Eom

Choi

et al. 2018

Polymer International

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“…Micro-DOEs are well-suited for planar optical systems due to their flexibility and compact size. Integration of various micro-DOEs can be accomplished using techniques like flip-chip solder bonding [367] . In recent years, as Moore’s law approaches its physical limits, there has been a decline in the pace of development for electronic computers.…”

Section: Applications Of Light Field Manipulationmentioning

confidence: 99%

Diffractive optical elements 75 years on: from micro-optics to metasurfaces

Zhang,

He,

Xie

et al. 2023

Photonics Insights

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Diffractive optical elements (DOEs) are intricately designed devices with the purpose of manipulating light fields by precisely modifying their wavefronts. The concept of DOEs has its origins dating back to 1948 when D. Gabor first introduced holography. Subsequently, researchers introduced binary optical elements (BOEs), including computer-generated holograms (CGHs), as a distinct category within the realm of DOEs. This was the first revolution in optical devices. The next major breakthrough in light field manipulation occurred during the early 21st century, marked by the advent of metamaterials and metasurfaces. Metasurfaces are particularly appealing due to their ultra-thin, ultra-compact properties and their capacity to exert precise control over virtually every aspect of light fields, including amplitude, phase, polarization, wavelength/frequency, angular momentum, etc. The advancement of light field manipulation with micro/nano-structures has also enabled various applications in fields such as information acquisition, transmission, storage, processing, and display. In this review, we cover the fundamental science, cuttingedge technologies, and wide-ranging applications associated with micro/nano-scale optical devices for regulating light fields. We also delve into the prevailing challenges in the pursuit of developing viable technology for real-world applications. Furthermore, we offer insights into potential future research trends and directions within the realm of light field manipulation.

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Bonding Techniques

Agajanian¹

1979

Microelectronic Packaging

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Flip Chip Bonding

Cited by 3 publications

References 0 publications

Crosslinkable deoxidizing hybrid adhesive of epoxy–diacid for electrical interconnections in semiconductor packaging

Crosslinkable deoxidizing hybrid adhesive of epoxy–diacid for electrical interconnections in semiconductor packaging

Diffractive optical elements 75 years on: from micro-optics to metasurfaces

Bonding Techniques

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