Flip-chip GaAs MMICs for microwave MCM-D applications

Wadsworth, S.D.; Buck, Brennan; Dearn, A.W.; Warner, D.J.; Juland, I.D.

doi:10.1109/icmcm.1998.670793

Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154)

DOI: 10.1109/icmcm.1998.670793

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Flip-chip GaAs MMICs for microwave MCM-D applications

S.D. Wadsworth

Brennan Buck²,

A.W. Dearn³

et al.

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“…Flip chip connections are becoming of increasing importance. The reduced parasitic effects in this connection technique are of primary importance for RF and microwave applications (Wadsworth et al, 1998). These parasitics are approximately one order of magnitude smaller than when using other connection techniques (e.g.…”

mentioning

confidence: 99%

Advances in microwave MCM‐D technology

Pieters

Raedt²,

Beyne³

2000

Microelectronics International

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The thin film multilayer multichip module technology (MCM‐D) was originally used for the interconnection of high speed digital circuits in a single module. Nowadays, the technology is more and more evolving towards use in the interconnection of RF and microwave circuits with integrated passive components. This paper gives an overview of this evolution towards microwave MCM‐D technology and the recent advances with respect to the integration of high quality passive components. With a discussion on the flip chip mounting of active devices, the link towards fully integrated high frequency front‐end systems is pointed out.

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mentioning

confidence: 99%

Advances in microwave MCM‐D technology

Pieters

Raedt²,

Beyne³

2000

Microelectronics International

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Flip-chip GaAs MMICs for microwave MCM-D applications

Cited by 1 publication

References 1 publication

Advances in microwave MCM‐D technology

Advances in microwave MCM‐D technology

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