Flip chip interconnect analysis at millimetre wave frequencies

Wong, Yiu-Huen; Patrison, L.; Linton, D.

doi:10.1109/hfpsc.1999.809284

Cited by 5 publications

(2 citation statements)

References 4 publications

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“…The common opinion is that MMICs designed in coplanar transmission line technology (coplanar waveguide, CPW) have a high compatibility with flip-chip mounting technology, while microstrip (MS) MMICs are not compatible. Various studies in the past have demonstrated design rules for finding the optimum bump height, distance or shape [2,3] in order to minimize the transition loss. In this paper, the proximity effect corresponding to the distance between chip and substrate is examined for both microstrip and coplanar MMICs.…”

Section: Introductionmentioning

confidence: 99%

An Investigation of the Proximity Effect of Millimeter-Wave MMICs in Flip-Chip Configuration

Nagy

Heide²,

Springer³

et al. 2001

31st European Microwave Conference, 2001

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Abstract¾ A comparison between flip-chip mounting of monolithic microwave integrated circuits (MMICs) in microstrip transmission line technology and coplanar transmission line technology is presented. The influence of substrate proximity effects on the electrical behavior of the MMICs is examined and illustrated in normalized frequency independent graphs. Based on the results of this work, the performance of microstripMMICs used in flip-chip configuration can be estimated as a function of the chosen assembly geometry.

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Section: Introductionmentioning

confidence: 99%

An Investigation of the Proximity Effect of Millimeter-Wave MMICs in Flip-Chip Configuration

Nagy

Heide²,

Springer³

et al. 2001

31st European Microwave Conference, 2001

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“…To avoid this interaction, the minimal separation between two face-to-face chips should be no less than 0.3 times the CPW ground-to-ground spacing [20]. For the microstrip circuits, two chips need to be separated farther apart, due to the field distribution of microstrip.…”

Section: Flip-chip Based Vertical Rf Transitionmentioning

confidence: 99%

Micromachined Millimeter- and Submillimeter-wave Circuits for Test and Integration

Chen¹

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The terahertz spectrum is critical to a wide range of scientific applications, from radio astronomy to remote sensing. However, due to the cost, size and weight of terahertz systems, the terahertz frequency range remains one of the least explored and utilized regions of the electromagnetic spectrum. To reduce the size, weight and cost of terahertz components, one of the solutions is to fabricate high density integrated circuits.Although progress has been made in the development of submillimeter-wave monolithic integrated circuits, the evaluation of these circuits still relies on test fixtures, which makes testing expensive and time consuming. A micromachined on-wafer probe covering frequencies 500-750 GHz has been demonstrated in this work to simplify submillimeterwave integrated circuits testing.This work also presents the design, simulation and measurement of a vertical RF interconnect with mechanical fit for three-dimensional heterogeneous integration, which is one of the major technologies for system miniaturization. The mechanical fit is a flip-chip strategy employing SU-8, an ultra-thick photoresist, to realize interlocking structures that prevent misalignment during assembly and increase the reliability of the interconnects. To determine the electromagnetic characteristics, such as insertion loss and the coupling between face-to-face chips, different test structures were fabricated and measured.To my parents for their long-term encouragement and believing in me.

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