Flip chip solder bump inspection using vibration analysis

Abstract

Flip chip technology is an attractive choice for high-density packaging and complex microsystem architectures. A critical element in the successful application of flip chip technology is the reliability of solder bumps. In this paper a nondestructive detection method is presented for the flip-chip solder bump inspection using ultrasonic excitation and vibration analysis. Simulations are implemented to explore the feasibility of this method, and experimental investigations are also performed, where the flip chips are excited by continuous ultrasonic waves and their vibration velocities are measured by a laser scanning vibrometer for further analysis. The results reveal that the defective chips can be distinguished from the good chips by the chip vibration velocities with the feature coefficient a, which proves the effectiveness of this method. Therefore, it may provide a new path for the improvement and innovation of flip chip on-line inspection systems.

Fault Diagnosis of Flip Chip Using Vibration and Modal Analysis

“…In this work, a non-destructive testing method based on the vibration and modal analysis is investigated for flip chip solder bump missing defect detection [7] . The flip chips with arrayed solder bumps are employed as the test samples and solder bump missing, a typical defect in flip-chip packaging [8] , is introduced.…”