Flow boiling of R245fa in a microgap with staggered circular cylindrical pin fins

Asrar, Pouya; Zhang, Xuchen; Green, Craig E.; Bakir, Muhannad S.; Joshi, Yogendra

doi:10.1016/j.ijheatmasstransfer.2017.12.117

Cited by 37 publications

(3 citation statements)

References 24 publications

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“…The one-dimensional TEC model that we used for our analysis is shown in Figure 2, in which all thermocouples are electrically coupled in series and thermally connected in parallel. The picture also shows the sizes of the various parts of a test chip designed specifically for our application [18]. The thermal resistance of the TEC elements is denoted in our analysis by TEC.…”

Section: Optimization Methods 1 Tec Modelmentioning

confidence: 99%

Development and Optimization of Microscale Cooling Devices for Electronics Cooling

2023

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The creation of effective cooling solutions has been required to address thermal difficulties as a result of the ongoing miniaturisation and rising power densities of electronic devices. The development and optimisation of microscale cooling devices specifically created for electronics cooling applications are the focus of the extensive investigation presented in this paper.This study's main goal is to investigate how microscale cooling technologies might improve heat dissipation efficiency in order to meet growing thermal management demands. Device design, fabrication, and optimisation were the three key processes that made up the methodical technique used to accomplish this.In order to maximise heat transfer, suitable materials with high thermal conductivity and low thermal resistance have to be chosen and integrated during the device design phase. Different design options, such as microchannels, microfins, and microjets, were taken into consideration to improve convective heat transmission and boost the devices' capacity for heat dissipation. Advanced simulation methods were also used to assess and improve the proposed designs' thermal performance.The microscale cooling devices were created during the manufacturing stage using microfabrication processes like photolithography, etching, and bonding. The selection of fabrication techniques was influenced by their suitability for use in mass manufacturing, cost-effectiveness, and high precision and reliability.In order to maximise heat transfer efficiency, the optimisation phase concentrated on fine-tuning device characteristics such channel diameters, flow rates, and surface improvements. To assess the thermal performance and enhance the cooling capacities of the microscale devices, experimental studies and computational fluid dynamics (CFD) simulations were carried out.The findings of this study show the important potential of microscale cooling technologies in efficiently controlling the heat produced by electronic components. The optimised designs preserve compact form factors appropriate for incorporation into contemporary electronic systems while exhibiting greater heat dissipation capabilities as compared to conventional cooling methods.

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Section: Optimization Methods 1 Tec Modelmentioning

confidence: 99%

Development and Optimization of Microscale Cooling Devices for Electronics Cooling

2023

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“…Sharafat et al [22,23] introduced metal foams as a heat transfer promoter of He gas flow pressurized to 40 MPa and demonstrated high cooling performance of >10 MW/m 2 . Furthermore, Joshi et al proposed a cooling technology that makes use of the phase change of coolant in a pin-fins microchannel for high heat generation density electronic devices exceeding 10 MW/m 2 [24][25][26]. Moreover, he attempted a technology that assists heat transfer in the promotion of evaporation in a nanoporous film via a gas impinging jet [27].…”

Section: Introductionmentioning

confidence: 99%

Heat Transfer Enhancement Using Unidirectional Porous Media under High Heat Flux Conditions

Yuki¹

2021

Porous Fluids - Advances in Fluid Flow and Transport Phenomena in Porous Media

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In this chapter, new heat transfer enhancement technologies with unidirectional porous metal called “EVAPORON” and “Lotus’ Breathing” are introduced to remove and manage heat from high heat flux equipment. The unidirectional porous metals introduced here can be easily fabricated by unique techniques such as mold casting technique, explosive welding technique, and 3D printing technique. First of all, many kinds of porous media, which have been introduced by the author so far as a heat transfer promoter, are compared each other to clarify what kind of porous metal is more suitable for high heat flux removal and cooling by focusing on the permeability and the effective thermal conductivity. For the practical use of the unidirectional porous copper with high permeability and high thermal conductivity, at first, heat transfer performance of two-phase flow cooling using a heat removal device called “EVAPORON” is reviewed aiming at extremely high heat flux removal beyond 10 MW/m2. We have been proposing this device with the unidirectional porous copper fabricated by 3D printing technique as the heat sink of a nuclear fusion divertor and a continuous casting mold. Second, two-phase immersion cooling technique called “Lotus’ Breathing” utilizing “Breathing Phenomenon” is introduced targeting at thermal management of various electronics such as power electronics and high performance computers. The level of the heat flux is 0.1 MW/m2 to 5 MW/m2. In addition, as the other heat transfer enhancing technology with unidirectional porous metals, unidirectional porous copper pipes fabricated by explosive welding technique are also introduced for heat transfer enhancement of single-phase flow.

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“…Particularly of interest are the conditions for flow visualization regarding flat, two-dimensional configurations of flow [2]. Several issues, mentioned in the recent literature, are related to the influence of size [3,4], orientation [5][6][7] and surface [8][9][10][11][12][13] structure of the minigap on heat transfer and pressure drop and also to the passive methods [8,[14][15][16].…”

Section: Introductionmentioning

confidence: 99%

Flow Boiling in Minigap in the Reversed Two-Phase Thermosiphon Loop

2019

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The paper presents the results of experimental investigations of a model of a heat exchanger featuring a minigap, which is perceived as an evaporator for an inverted thermosiphon. The system works with a single component test fluid. The tested evaporator generates pumping power in the test loop in a way similar to the mammoth pump. The tests regarded a module of the heat exchanger, consisting of a hot leg and a cold leg with the width by the length of 0.1 × 0.2 m, heated by a uniform heat flux. In the tests, the minigaps of 1, 2 and 3 mm were formed. Two fluids, namely, distilled water and ethanol, were tested in the facility. Two-phase flow structures for both working fluids and various operational parameters, together with comprehensive visualization material, are presented. The specifics of pressure changes and its influence on operating parameters and flow structure are discussed.

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Flow boiling of R245fa in a microgap with staggered circular cylindrical pin fins

Cited by 37 publications

References 24 publications

Development and Optimization of Microscale Cooling Devices for Electronics Cooling

Development and Optimization of Microscale Cooling Devices for Electronics Cooling

Heat Transfer Enhancement Using Unidirectional Porous Media under High Heat Flux Conditions

Flow Boiling in Minigap in the Reversed Two-Phase Thermosiphon Loop

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