Group III-nitride
light-emitting diodes (LEDs) fabricated on sapphire
substrates typically suffer from insufficient heat dissipation, largely
due to the low thermal conductivities (TCs) of their epitaxial layers
and substrates. In the current work, we significantly improved the
heat-dissipation characteristics of an InGaN/GaN quantum-well (QW)
green LED by using hexagonal boron nitride (hBN) as a heat-transfer
medium. Multiple-layer hBN with an average thickness of 11 nm was
attached to the back of an InGaN/GaN-QW LED (hBN-LED). As a reference,
an LED without the hBN (Ref-LED) was also prepared. After injecting
current, heat-transfer characteristics inside each LED were analyzed
by measuring temperature distribution throughout the LED as a function
of time. For both LED chips, the maximum temperature was measured
on the edge n-type electrode brightly shining fabricated on an n-type
GaN cladding layer and the minimum temperature was measured at the
relatively dark-contrast top surface between the p-type electrodes.
The hBN-LED took 6 s to reach its maximum temperature (136.1 °C),
whereas the Ref-LED took considerably longer, specifically 11 s. After
being switched off, the hBN-LED took 35 s to cool down to 37.5 °C
and the Ref-LED took much longer, specifically 265 s. These results
confirmed the considerable contribution of the attached hBN to the
transfer and dissipation of heat in the LED. The spatial heat-transfer
and distribution characteristics along the vertical direction of each
LED were theoretically analyzed by carrying out simulations based
on the TCs, thicknesses, and thermal resistances of the materials
used in the chips. The results of these simulations agreed well with
the experimental results.