2015
DOI: 10.1063/1.4913221
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Fluid simulation and experimental validation of plasma radial uniformity in 60 MHz capacitively coupled nitrogen discharges

Abstract: A two-dimensional self-consistent electrostatic fluid model and the experimental diagnostic method are employed to investigate the plasma radial uniformity in capacitively coupled nitrogen discharges driven at 60 MHz. The effects of the rf power and electrode gap on the spatial profiles of the N2+ ion density and the radial profiles of the ion flux to the lower electrode are demonstrated. It is found in the simulation that with the increase of rf power or the decrease of electrode gap, the electrostatic edge e… Show more

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Cited by 12 publications
(5 citation statements)
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“…In recent years, Wang and his group developed a software platform for Multi-physics Analysis of Plasma Sources (MAPS), which contains three models, i.e., the fluid model, [4][5][6][9][10][11] the Particle-In-Cell/Monte Carlo (PIC/MC) model [8,[12][13][14][15] and the global model. [16] The MAPS can be used to investigate the plasma behaviors in CCP and inductively coupled plasma (ICP) discharges.…”
Section: Plasma Equationsmentioning
confidence: 99%
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“…In recent years, Wang and his group developed a software platform for Multi-physics Analysis of Plasma Sources (MAPS), which contains three models, i.e., the fluid model, [4][5][6][9][10][11] the Particle-In-Cell/Monte Carlo (PIC/MC) model [8,[12][13][14][15] and the global model. [16] The MAPS can be used to investigate the plasma behaviors in CCP and inductively coupled plasma (ICP) discharges.…”
Section: Plasma Equationsmentioning
confidence: 99%
“…Besides, other BCs, which are also needed to complete the model, have been described previously in Ref. [4]. So a brief description is here.…”
Section: Dielectric Boundarymentioning
confidence: 99%
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“…Moreover, in recent years, the feature size of the chip continues shrinkage, which leads to more stringent requirements for CCP density uniformity. Therefore, the modulation of CCP plasma uniformity has become a current research focus [15,16].…”
Section: Introductionmentioning
confidence: 99%
“…Despite various efforts, technically complex issues such as the electron heating mechanism and the plasma distribution control have not been sufficiently resolved in the coating process using the capacitively coupled plasma (CCP) deposition reactors [1,2]. However, CCP deposition reactors have been widely adopted in the current semiconductor industry [3].…”
Section: Introductionmentioning
confidence: 99%