Fluid-to-Fluid Spot-to-Spreader (F2/S2) Hybrid Heat Sink for Integrated Chip-Level and Hot Spot-Level Thermal Management

Green, Craig; Fedorov, Andrei G.; Joshi, Yogendra

doi:10.1115/1.3104029

Cited by 27 publications

(6 citation statements)

References 16 publications

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“…This study is promising as it shows how the increased density of electronic components can be mounted on a PCB. In thermal management study, an F2/S2 hybrid heat sink were introduced with combined chip-level and hot-spot-level thermal management (Green et al, 2009). Large hot-spot fluxes approaching 400 W/cm 2 can be dissipated efficiently using an F2/S2-designed system with minimal pumping power load with lower flux levels.…”

Section: Heat Sinks For Modern Applicationsmentioning

confidence: 99%

A design approach for thermal enhancement in heat sinks using different types of fins: A review

Gaikwad

Sathe²,

Sanap³

2023

Front. Therm. Eng.

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This article provides an in-depth overview of thermal heat sink design and optimization. Heat transfer enhancement strategies are discussed in detail, followed by fin design trends and geometries, and a discussion on different fin configurations and their merits is also presented. Important results and findings of experiments concerning the design and optimization of fin geometries have been summarized. For complex heat dissipation applications, researchers have been studying different fin arrangements especially, inclined fins, to maximize the performance of the heat sinks. Along with innovative fin designs, microchannels for heat dissipation are gaining attention due to their. Recent advances in this domain have been discussed. New components are becoming more compact and advanced as a result of technological breakthroughs in electronics and control systems; hence, the use and optimization of heat sinks for modern applications are also discussed in this article.

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Section: Heat Sinks For Modern Applicationsmentioning

confidence: 99%

A design approach for thermal enhancement in heat sinks using different types of fins: A review

Gaikwad

Sathe²,

Sanap³

2023

Front. Therm. Eng.

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“…A 28% and 43% reduction in flow rate and system pumping power were, respectively, achieved compared to the unaltered cold plate if a 20°C junctionto-inlet temperature difference is allowed. A fluid-to-fluid spot-to-spreader (F2/S2) hybrid heat sink was introduced by Green et al [6] as an integrated chip level and hotspot level thermal management technique. The heat sink employs two separate fluids, which are distinct and do not mix directly, for cooling the hotspots and background heat flux.…”

Section: Introductionmentioning

confidence: 99%

Hotspot Mitigating With Obliquely Finned Microchannel Heat Sink—An Experimental Study

Lee

Chou

2013

IEEE Trans. Compon., Packag. Manufact. Technol.

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Sectional oblique fins are employed, in contrast to continuous fins, in order to modulate the flow in a microchannel heat sink. The breakage of continuous fin into oblique sections leads to reinitialization of boundary layers and generation of secondary flows that significantly enhance the cooling performance of the heat sink. In addition, an oblique finned microchannel heat sink has the flexibility to tailor local heat transfer performance by varying its oblique fin pitch. Clusters of oblique fins at higher density can be created in order to promote a greater degree of boundary layer redevelopment and secondary flow generation to provide more effective cooling at the high heat-flux region. Thus, the variation of oblique fin pitch can be exploited for hotspot mitigation. Experimental studies of a silicon chip with two hotspot scenarios show that the temperature hike and the temperature difference for the enhanced microchannel heat sink with variable pitch are reduced by as much as 17.1°C and 15.4°C, respectively. As a result, temperature distribution across the silicon chip is more uniform. In addition, the associated pressure drop penalty is much smaller than the achieved heat transfer enhancement, rendering it as an effective hotspot mitigating strategy for the single-phase microchannel heat sink.Index Terms-Enhanced microchannel, hotspot cooling, oblique fins, variable pitch.

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“…With the development of modern electronic devices towards multifunction, miniaturization, and high integration, large amounts of heat in a chip cannot opportunely dissipate and further accumulate, causing hot spots which threaten the lifetime and reliability of an electronic device [1,2]. In fact, the progress of electronic devices has been restricted by the absence of effective heat management methods within highpower-density electronic devices [3]. With high aspect ratios and excellent thermal conductivity, graphene and boron nitride have become the focus of attention for improving the thermal conductivity of polymer, especially in the in-plane direction [4,5].…”

Section: Introductionmentioning

confidence: 99%

Construction of low melting point alloy/graphene three-dimensional continuous thermal conductive pathway for improving in-plane and through-plane thermal conductivity of poly(vinylidene fluoride) composites

Zhang¹,

Zhang²,

Ding³

et al. 2020

Nanotechnology

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As the temperature of hot spots increases in electronic devices, thermal management is a key issue for maintaining a device’s reliability and performance. The usual approaches of quickly extracting the heat from the hot spots have focused on aligning two-dimensional filler along the in-plane orientation in the polymer matrix. Meanwhile, improving the through-plane thermal conductivity of polymer-based composites is as important as in-plane thermal conductivity. In this study, poly(vinylidene fluoride) composites with three-dimensional continuous thermal conductive pathways of a low melting point alloy (LMPA)/graphene were prepared through a two-step method. Poly(vinylidene fluoride)@graphene (PVDF@Gr) microspheres were firstly prepared by an in-situ water-vapor induced phase separation method. Subsequently, PVDF@Gr/LMPA composites were obtained by hot-pressing after mixing the LMPA with the PVDF@Gr microspheres. Attributed to the unique solid-liquid phase transition advantage of the LMPA and the good matching of the phonon power spectrum between the LMPA and the graphene, the PVDF@4.8Gr/10LMPA composites with 4.8 vol% graphene and 10.0 vol% LMPA exhibited an outstanding in-plane thermal conductivity of 9.41 W m−1 K−1 and through-plane thermal conductivity of 0.35 W m−1 K−1, which was nearly increased by 245% and 130% compared to that of the PVDF@4.8Gr composites, respectively. The enhanced elasticity modulus and reduced thermal expansion coefficient were attributed to the LMPA constructing a three-dimensional continuous thermal conductive pathway along with the graphene and reducing interface thermal resistance. This study offeres a straightforward and repeatable method for fabricating highly thermally conductive polymer composites and widens the application of LMPAs in the fields of thermal management.

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Fluid-to-Fluid Spot-to-Spreader (F2/S2) Hybrid Heat Sink for Integrated Chip-Level and Hot Spot-Level Thermal Management

Cited by 27 publications

References 16 publications

A design approach for thermal enhancement in heat sinks using different types of fins: A review

A design approach for thermal enhancement in heat sinks using different types of fins: A review

Hotspot Mitigating With Obliquely Finned Microchannel Heat Sink—An Experimental Study

Construction of low melting point alloy/graphene three-dimensional continuous thermal conductive pathway for improving in-plane and through-plane thermal conductivity of poly(vinylidene fluoride) composites

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