Fluorine passivation of metal surface for self-cleaning semiconductor equipment

Miki, Nobuhiko; Maeno, M.; Maruhashi, K.; Nakagawa, Yasuaki; Ohmi, Tadahiro

doi:10.1109/66.47970

Cited by 24 publications

(13 citation statements)

References 9 publications

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“…As described in the previous papers [6]- [8], it has a non-stoichiometric structure. Therefore, the direct fluoridated film does not have favorable characteristics in terms of the corrosion resistance, outgassing and other aspects.…”

Section: Optimum Condition For Bakingmentioning

confidence: 89%

“…Previous articles by the authors [6]- [8] provide information on fluoridated surfaces on several metals. They also show, that the best passivating film on nickel and stainless steel can be formed only by a two-step fluoridation process [6]. The composition of the film formed in the first step, i.e.…”

Section: Introductionmentioning

confidence: 98%

“…The fluoridation mechanism as well as the process steps leading to a well passivated surface film have been discussed in the literature [6]- [12]. Previous articles by the authors [6]- [8] provide information on fluoridated surfaces on several metals.…”

Section: Introductionmentioning

confidence: 99%

“…The purpose of this work is to pursue the optimization of the previously published methodology [6] for the 3 16L stainless steel. The optimum condition for a three-step process, composed of baking, direct fluoridation and thermal modification steps was examined.…”

Section: Introductionmentioning

confidence: 99%

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Optimization of fluorine passivation of stainless steel surfaces

Maeno

Nakagawa

Miki

et al. 1992

IEEE Trans. Semicond. Manufact.

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The passivation consists of three steps, that is, the baking process, the direct fluoridation and the thermal modification process. Each of the steps was evaluated in terms of surface flatness, chemical composition and structure. The optimum conditions for the fluorine passivation technology of 316L stainless steel are described. The direct fluoridation products formed at the temperature of 320°C or lower have the single-phase composition of FeF,, while those which were formed at the temperatures of 330°C or higher have the compoundphase composition with FeFz and FeF,. At certain critical temperature (400°C for 316L stainless steel) of the thermal modification, FeF, is converted to FeF, and disappears completely as the temperature rises. Meanwhile CrF, is formed at certain temperature (440°C for 316L stainless steel). The compoundphase composition gets further crystallized as the thermal modification temperature rises. As the crystal growth induces the cracks on the fluoridated film, it is very difficult to form a satisfactory passivation film from the compound-phase composition by thermal modification. It is confirmed that excellent passivation film has been obtained from the single-phase composition by the optimum fluoridation following the optimum thermal modification.

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Section: Optimum Condition For Bakingmentioning

confidence: 89%

Section: Introductionmentioning

confidence: 98%

Section: Introductionmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

See 2 more Smart Citations

Optimization of fluorine passivation of stainless steel surfaces

Maeno

Nakagawa

Miki

et al. 1992

IEEE Trans. Semicond. Manufact.

Self Cite

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show abstract

“…The remote plasma cleaning processes of the silicon dioxide and silicon nitride layers using PFCs such as C 2 F 6 , C 3 F 8 , C 4 F 8 , and NF 3 have been studied and used in the flat panel display (FPD) industry [10][11][12][13][14][15][16][17][18][19][20][21][22][23][24][25][26]. The PFCs that are reemitted during chamber etching, however, are known to have a serious global warming effect in the atmosphere [10][11][12][13][14][15][20][21][22][23][24][25][26].…”

Section: ) Gasesmentioning

confidence: 99%