“…The presence of defects/trap states in the perovskite film causes severe trap-assisted recombination, which leads to a high open-circuit voltage ( V oc ) loss. This V oc loss can be suppressed by passivating the defects present in the perovskite layer. − To enhance the perovskite film quality and reduce trap state, different approaches have been established, such as solvent engineering of precursor solution, development of coating procedure, composition engineering, off-stoichiometric passivation, antisolvent engineering, , utilizing organic molecules in antisolvent, , interface engineering, − and additive engineering. − Among these methods, additive engineering is one of the effective approaches for achieving high-quality perovskite films because of the vast diversity present in their functionality and structure. , D−π–A molecules with −COOH group, phenyl-C61-butyric acid methyl ester (PCBM), and C60-PEG have been added in the antisolvent for defect passivation. , The use of these molecules in antisolvent helps in the passivation of surface defects only. Numerous materials have been investigated as additives in perovskite precursor solution including organic halide salts, metal halide salts, inorganic acids, fullerenes, polymers, and nanoparticles. ,− Many of these additives such as IT-4F, F4TCNQ, PVP (poly(4-vinylpyridine)), polyamic acid and polyimide, fullerene derivatives and ITIC, , organic dye (AQ310), p-type conjugated polymers PBDB-T, and P3HT were able to passivate the defects of perovskite films.…”