2018
DOI: 10.1016/j.procir.2018.08.210
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Flushing Velocity Observations and Analysis during EDM Drilling

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Cited by 18 publications
(12 citation statements)
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“…The EDM efficiency was also enhanced as the electrode rotation improved the flushing of the dielectric liquid out of the machining gap, resulting in a more uniform GC profile and lower incidence of recast layer. These findings are consistent with those of Kliuev et al [13]. They reported that insufficient flushing has a tendency to increase the recast layer thickness, and the effect is significant for high aspect ratios of hole diameter and hole depth.…”
Section: Characteristics Of Gc Of Edm With Side and Multi-aperture Flushingsupporting
confidence: 93%
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“…The EDM efficiency was also enhanced as the electrode rotation improved the flushing of the dielectric liquid out of the machining gap, resulting in a more uniform GC profile and lower incidence of recast layer. These findings are consistent with those of Kliuev et al [13]. They reported that insufficient flushing has a tendency to increase the recast layer thickness, and the effect is significant for high aspect ratios of hole diameter and hole depth.…”
Section: Characteristics Of Gc Of Edm With Side and Multi-aperture Flushingsupporting
confidence: 93%
“…Meanwhile, pulse on-time and electrical current influenced the deep hole profile [12]. Flushing plays a crucial role in the EDM process, since flushing removes debris from the machining gap and affects the EDM performance and deep hole characteristics [13]. Side flushing is conventionally used in EDM due to its simplicity and relatively efficient debris removal.…”
Section: Introductionmentioning
confidence: 99%
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“…One of EDD’s limitations during deep hole drilling is caused by the accumulation of debris at the bottom of the hole, which contributes to the wearing of the reinforced side electrode and secondary discharges (e.g., arcing and short circuits). An especially high concentration of eroded particles occurs in the corner of the drilled hole [16]. These phenomena lead to high process instability, defects on the internal surface of the holes, holes with poor shape accuracy (in terms of hole taper and hole dilation), excessive tool wear (at the side and the end), and a low machining speed [12,13,14,17,18,19].…”
Section: Introductionmentioning
confidence: 99%
“…Flushing with a high dielectric pressure can sweep the plasma channel and lead to a decrease in the material removal rate [21]. To improve flushing, several methods can be applied, including internal flushing (flushing through single-and multi-channel electrodes) [13,16], external flushing, suction, different electrode movements (rotary, planetary) [18], vibration-assisted methods [12], simultaneous flushing with a vacuum-assisted debris removal system [21,22], and the use of tool electrodes coated with a material of low electrical conductivity [14].…”
Section: Introductionmentioning
confidence: 99%