1987
DOI: 10.1016/0167-9317(87)90092-x
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Focused ion beam repair in microelectronics

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Cited by 12 publications
(1 citation statement)
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“…When a broad beam of ions with maximum breadth of 500 mm 2) collides with atoms of a target material, the ions' kinetic energy is transferred to surface atoms of the target. If the energy is larger than the sublimation energy of the surface atoms, 3) the atoms are sputtered away and consequently a clean surface can be created. A technique using the ion milling for preparation of polished cross sections was demonstrated with good quality of backscattered SEM image by the manufacturer of a so-called cross-section polisher 4) and was applied for high spatial resolution electron probe X-ray microanalysis of an iron alloy.…”
Section: Introductionmentioning
confidence: 99%
“…When a broad beam of ions with maximum breadth of 500 mm 2) collides with atoms of a target material, the ions' kinetic energy is transferred to surface atoms of the target. If the energy is larger than the sublimation energy of the surface atoms, 3) the atoms are sputtered away and consequently a clean surface can be created. A technique using the ion milling for preparation of polished cross sections was demonstrated with good quality of backscattered SEM image by the manufacturer of a so-called cross-section polisher 4) and was applied for high spatial resolution electron probe X-ray microanalysis of an iron alloy.…”
Section: Introductionmentioning
confidence: 99%