toward flexibility, intelligence, and high integration, and the materials with good photoelectric performance, excellent processibility, low cost, good reliability, and chemical stability are highly desirable.Compared with traditional rigid devices, flexible electronics can adapt to different working environments and meet the requirements of various deformations while maintaining the normal functions of electronic devices. In flexible photoelectric devices, the flexible transparent conducting electrodes (FTCEs) are an indispensable part, and currently the most widely used FTCE is indium tin oxide (ITO)-coated transparent plastic film. However, ITO coated film has the following shortcomings: high cost of indium, large material waste in the production process, the requirement of expensive highvacuum equipment, and the most important one-intrinsic brittleness of ITO, which is incompatible with the future lowcost wearable flexible electronic devices. [13] In order to develop inexpensive and reliable alternatives of ITO, many novel materials and fabrication methods have been put forward. Metal nanowires (NWs) are considered to be the most promising alternatives of ITO for fabricating high-performance FTCEs. [13] Recently, silver nanowires mesh structures have been widely employed as conductive layer on flexible transparent substrate, and superior light transmission and conductivity have been obtained. More importantly the performance degradation of Attributed to high power density and controllable digital program operation, lasers are a powerful tool in the preparation, prototype fabrication, and post-processing of materials. In this paper, a general laser ablation strategy that can be conducted under ambient, room-temperature, and mask-free conditions is employed for the rapid fabrication of robust large-area copperbased flexible electronics. Micrometer-scale thick copper layer cladded on flexible polymer substrate can be removed efficiently in one laser scanning pass based on laser-induced heat evaporation effect. Metal grids with a width less than 10 microns and a thickness close to 2 microns can be produced in a reliable manner. As proof-of-concept demonstrations, flexible transparent conducting electrodes and a variety of flexible circuit boards (FCBs) with different precisions and dimensions are fabricated by this approach in a digitally controlled mode and their photoelectric properties under normal and deformation states are investigated. The results indicate that the method is robust and asprepared flexible electrodes and circuits are reliable and endurable, indicative of the potential of this method in scalable fabrication of sub-millimeter flexible electronics through a straightforward and flexible fashion.