Forced convection in finned metal foams: The effects of porosity and effective thermal conductivity

Kemerli, Ubade; Kahveci, Kamil

doi:10.1016/j.ijthermalsci.2020.106756

Cited by 15 publications

(1 citation statement)

References 27 publications

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“…Hung et al [10,11] examined the thermal performance of microchannels (MCHS) with inserted porous media and showed that foam materials offer better heat-transfer performance. The numerical results of Kemerli and Kahveci [12] demonstrate that the addition of metal foams causes a small increase in the friction factor, while the heat transfer shows a significant increase until the addition of a certain number of fins. Bhattacharya et al [13] experimentally studied the forced convective heat transfer in new finned metal foam heat sinks (MFHS).…”

Section: Introductionmentioning

confidence: 99%

Numerical Studies of Thermal Management of Multiple Electronic Devices Using Metal Foam Heat Sinks

Sid¹,

Boulahrouz²,

Saoudi³

et al. 2022

J. Nano- Electron. Phys.

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In this study, metal foam heat sinks (MFHS) are proposed for thermal management of electronic devices. Metal foams are excellent candidates for improving the heat transfer performance of heat sinks due to their unique characteristics such as the large surface area to volume ratio and their complex form, which favors mixing and convection. Numerical investigations of the transient thermal-hydraulic behavior and performance of the cooling process of electronic devices by MFHS are carried out. The physical model consists of a convective laminar air flow inside a channel equipped with multiple power electronic devices cooled by MFHS. MFHS consist of three plate fin heat sinks which are made of aluminum foam with a porosity of 0.95 and a permeability of 1.65  10 -7 m 2 , and the heat sink base is made of aluminum solid. Comsol software is used to solve the governing equations. Numerical results reveal that the thermal performance of MFHS is larger than that of a conventional heat sink and a clear channel under the same operating conditions, and the thermal behavior of electronic devices cooled by MFHS is stable and maintained at admissible temperatures. The validation of the numerical results shows perfect agreement with the experimental data with a maximum relative error of 3 %.

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Section: Introductionmentioning

confidence: 99%

Numerical Studies of Thermal Management of Multiple Electronic Devices Using Metal Foam Heat Sinks

Sid¹,

Boulahrouz²,

Saoudi³

et al. 2022

J. Nano- Electron. Phys.

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Eco‐Friendly Transparent Silk Fibroin Radiative Cooling Film for Thermal Management of Optoelectronics

Chen

Hwang

Chang

et al. 2023

Adv Funct Materials

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Although transparent radiative cooling is a passive cooling strategy with practical applications and aesthetic appeal, complex manufacturing processes and the use of environmentally unfriendly thermal emitters remain latent problems. Herein, eco‐friendly transparent silk radiative cooling (TSRC) films are developed, regenerated from natural silkworm cocoons, for zero‐energy‐consumption thermal management of optoelectronic devices. These TSRC films can dissipate heat radiatively through molecular vibrations of the protein backbone and side chains, while retaining the function and appearance of the associated devices, due to their high visible transparency. Theoretical and experimental investigations revealed that the thermal emission increases rapidly upon increasing the film thickness, but slowly thereafter achieves saturation; nevertheless, the intrinsic solar absorption of silk in the ultraviolet and near‐infrared regions also grows linearly, unavoidably weakening the cooling effect. After spectroscopic optimization, the maximum cooling power during the daytime and nighttime is improved to 77.6 and 101.7 W m−2, respectively. Gratifyingly, the films have a remarkable effect on the cooling performance of electronic devices under sunlight. For example, the TSRC film provides a temperature drop of 5.1 °C for a smartphone during multitasking and charging, and 14 °C for a silicon solar panel with an improvement in the photoelectronic conversion efficiency (≈7%).

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Improvement of Heat Transfer by Mixed Convection in a Channel Partially Filled with Metallic Foam Subjected to Solar Radiation

Khadhrawi,

Mhamdi,

Ben Hamed

et al. 2023

Lecture Notes in Mechanical Engineering

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Forced convection in finned metal foams: The effects of porosity and effective thermal conductivity

Cited by 15 publications

References 27 publications

Numerical Studies of Thermal Management of Multiple Electronic Devices Using Metal Foam Heat Sinks

Numerical Studies of Thermal Management of Multiple Electronic Devices Using Metal Foam Heat Sinks

Eco‐Friendly Transparent Silk Fibroin Radiative Cooling Film for Thermal Management of Optoelectronics

Improvement of Heat Transfer by Mixed Convection in a Channel Partially Filled with Metallic Foam Subjected to Solar Radiation

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