Fork-Coupled Resonators for Characterization of Mold Material for 5G Applications

Kanitkar, Abhijeet; Chernobryvko, Mykola; Rossi, Marco; Ndip, Ivan; Braun, T.; Müller, Friedrich; Lang, K.-D.; Wieland, Marcel; Goetze, Christian; Halim, Saquib Bin; Trewhella, Jean

doi:10.23919/mikon48703.2020.9253857

Cited by 7 publications

(2 citation statements)

References 11 publications

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“…On top of the RDL, an EMC of 300 µm thickness is applied being metallised with another Cu layer of 3 µm thickness (Cu Layer 1). The PI material was characterized using the procedure described in [16] with corresponding dielectric permittivity εr,PI = 3.5 and dielectric loss tanδPI = 0.008 at 12 GHz. Similarly, the EMC properties were extracted at 12 GHz yielding the permittivity εr,EMC = 3.66 and the dielectric loss tanδ EMC = 0.004.…”

Section: B Stack-up and Materialsmentioning

confidence: 99%

High-Q Ku-band Microstrip Spiral Resonator in Fan-out Wafer-Level Packaging (FoWLP) Technology for VCO Applications

Chernobryvko,

Kaiser,

Murugesan

et al. 2024

IMAPSource Proceedings

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In this paper, a planar spiral resonator operating at 13 GHz is investigated. The resonator was fabricated using fan-out wafer level packaging (FoWLP) technology. The field analysis highlights the importance of via fence. Two thick film resistors suppress an undesired resonance in proximity of targeted one. The measurements demonstrate a very good correlation in comparison with full-wave simulations. The measured Q-factor defined based on analysis of feedback oscillatory system is about 48. The proposed configuration is suitable for voltage-controlled oscillators (VCOs) with a resonator realized in package.

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Section: B Stack-up and Materialsmentioning

confidence: 99%

High-Q Ku-band Microstrip Spiral Resonator in Fan-out Wafer-Level Packaging (FoWLP) Technology for VCO Applications

Chernobryvko,

Kaiser,

Murugesan

et al. 2024

IMAPSource Proceedings

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“…This is because it has the advantages of simpler process, lower cost, and lighter weight. In plastic IC packaging, most of the materials are epoxy polymer [ 2 , 3 , 4 , 5 , 6 , 7 , 8 , 9 ]. Moisture adsorbed by the epoxy polymer can result in delamination, aging, and popcorn problems under high temperature [ 10 , 11 , 12 , 13 , 14 , 15 , 16 ].…”

Section: Introductionmentioning

confidence: 99%

Molecular Dynamics Investigation of the Thermo-Mechanical Properties of the Moisture Invaded and Cross-Linked Epoxy System

Sheng

Sun

et al. 2021

Polymers

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In spite of a high market share of plastic IC packaging, there are still reliability issues, especially for the effects of moisture. The mechanism between moisture and epoxy polymer is still obscure. A multi-step cross-linking approach was used to mimic the cross-linking process between the DGEBA resin and JEFFAMINE®-D230 agent. Based on the molecular dynamics method, the thermo-mechanical properties and microstructure of epoxy polymer were analyzed. In this paper, the degree of cross-linking ranged from 0% to 85.4% and the moisture concentration ranged from 0 wt.% to 12 wt.%. The hydrogen bonds were investigated in the moisture invaded epoxy polymer. Although most of the hydrogen bonds were related to water molecules, the hydrogen bonds between the inside of epoxy polymer were reduced only a little as the concentration of moisture increased. The diffusion coefficient of the water molecules was found to increase with the increase of moisture concentration. When the moisture concentration was larger than 12 wt.% or smaller than 1.6 wt.%, the diffusion coefficient was less affected by the epoxy polymer. In addition, the free volume and the thermal conductivity of the epoxy polymer were considered. It was found that the moisture could increase the thermal conductivity from 0.24 to 0.31 W/m/K, identifying a coupling relationship between moisture and thermal properties. Finally, the mechanical properties of epoxy polymer were analyzed by uniaxial tensile simulation. The COMPASS and DREIDING force fields were used during the uniaxial tensile simulation. A better result was achieved from the DREIDING force field compared with the experiment. The degree of cross-linking was positively correlated with mechanical properties. For the system with the largest degree of cross-linking of 85.4%, the Young’s modulus was 2.134 ± 0.522 GPa and the yield strength was 0.081 ± 0.01 GPa. There were both plasticizing and anti-plasticizing effects when the water molecules entered the epoxy polymer. Both the Young’s moduli and yield strength varied in a large range from 1.38 to 2.344 GPa and from 0.062 to 0.128 GPa, respectively.

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The Impact of Ageing on the Dielectric Properties of Laminates for 79 GHz Automotive Radar

Köszegi

Rossi

Wittler

et al. 2021

2021 IEEE 71st Electronic Components and Technology Conference (ECTC)

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Fork-Coupled Resonators for Characterization of Mold Material for 5G Applications

Cited by 7 publications

References 11 publications

High-Q Ku-band Microstrip Spiral Resonator in Fan-out Wafer-Level Packaging (FoWLP) Technology for VCO Applications

High-Q Ku-band Microstrip Spiral Resonator in Fan-out Wafer-Level Packaging (FoWLP) Technology for VCO Applications

Molecular Dynamics Investigation of the Thermo-Mechanical Properties of the Moisture Invaded and Cross-Linked Epoxy System

The Impact of Ageing on the Dielectric Properties of Laminates for 79 GHz Automotive Radar

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