The reaction mechanism of thin cobalt ͑Co͒ films with silicon dioxide ͑SiO 2 ͒ substrate under rapid thermal annealing conditions has been investigated. Reaction of thin cobalt film ͑12.5 nm͒ with a SiO 2 substrate is observed in an inert ambient ͑N 2 ͒ and in vacuum ͑ϳ10 Ϫ8 Torr͒. The reaction is manifested by the formation of craterlike depressions on the SiO 2 substrate and by the presence of a Co 2 SiO 4 reaction product determined by transmission electron microscopy diffraction patterns. Much less damage is observed with no reaction product observed if the samples are annealed in a forming gas ambient ͑90% N 2 /10% H 2 ͒, the cobalt film is much thicker ͑150 nm͒, or the cobalt film is in situ cleaned ͑e.g., 5 min in 400°C, forming gas ambient͒ prior to annealing in either inert or vacuum ambient. It is proposed that the presence of oxygen is required in order to initiate the reaction between cobalt and SiO 2 . The source of the oxygen contaminant, in our studies, is the oxygen on the surface of the cobalt film. The proposed reaction is 2 CoϩSiO 2 ϩ2͗0͘→Co 2 SiO 4 where ͗0͘ represents oxygen contaminant at the surface.