“…Moreover, SiO 2 is used as a dielectric material in microelectronic circuits. Several techniques have been used to deposit TiO 2 and SiO 2 thin films, including chemical vapor deposition (CVD) [ 7 , 8 ], molecular beam epitaxy [ 9 , 10 ], plasma-enhanced chemical vapor deposition [ 11 , 12 ], the sol–gel process [ 13 , 14 ], and pulsed laser deposition (PLD) [ 15 , 16 ], etc. PLD is a physical vapor deposition technique that uses high-energy laser pulses to ablate the target’s material to obtain, via vapor condensation on a substrate, thin films with excellent structural and optical properties.…”