Formation of a robust Cu adhesive layer on poly(ether ether ketone) via self UV-initiated surface polymerization

Hur, Joon; Lee, Joonbum; Kim, Boyoung; Yoo, Myong Jae; Seo, Ji‐Hun

doi:10.1016/j.jiec.2022.05.026

Cited by 8 publications

(9 citation statements)

References 33 publications

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“…The copper-adhesive polymer p(GMA-co-MPS) was grafted onto the PEEK films using the method described in our previous study. 22 The surfaces of the polymer films were cleaned via ultrasonic treatment with a 1 wt % sodium dodecyl sulfate solution, followed by washing with distilled water and methanol. After complete drying, the samples were submerged in a 10 × 10 cm UV cell filled with an argonpurged acetonitrile solution containing GMA and MPS monomers at concentrations of 1.0 and 0.5 mol/L, respectively.…”

Section: Polymer Grafting and 90°peelmentioning

confidence: 99%

“…This process requires verification for its effectiveness on the synthesized low-k PEEK substrates as the grafting of Cu-adhesive polar monomers might encounter interference from various nonpolar bulky side groups within the substrate. 22 TB 25 BP 75 -PEEK, which exhibited the lowest dielectric constant and loss among all of the samples, was grafted with p(GMA-co-MPS) using the composition determined in our previous study. The polymer grafting onto the PEEK substrates was confirmed through XPS and FT-IR spectroscopy (Figures 6c, S4 and S5).…”

Section: Cu-adhesive Polymer Grafting and 90°peelmentioning

confidence: 99%

“…The appearance of a new peak at 1732 cm −1 , corresponding to the carbonyl stretch of the ester bond, also provides evidence for the presence of grafted p(GMA-co-MPS). 22 The peel strength of p(GMA-co-MPS)-grafted TB 25 BP 75 -PEEK was measured and is shown in Figure 6e, along with that of p(GMA-co-MPS)-grafted unmodified PEEK and bonding sheet-laminated polyimide films for comparison. The peel strength of the grafted TB 25 BP 75 -PEEK exhibited a high value of 11.45 N/cm, which was approximately 2.2 times greater than that of the polyimide adhesive composite and approximately 1.2 times greater than that of unmodified PEEK.…”

Section: Cu-adhesive Polymer Grafting and 90°peelmentioning

confidence: 99%

“…In our previous study, we successfully grafted a polymer with copper adhesion properties onto the PEEK surface using the self-initiation characteristics of the benzophenone moiety present in the repeating units of PEEK. This process resulted in a strong copper adhesion of 9.4 N/cm while maintaining the mechanical and dielectric properties of the polymer substrate . However, PEEK exhibits a relatively high dielectric constant ( k > 3.0) owing to its crystalline structure, where dipoles are densely packed.…”

Section: Introductionmentioning

confidence: 99%

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Synthesis of Low-k Poly(ether ether ketone) Films and Surface Functionalization for Exceptional Copper Adhesive Properties

Jang,

Seo

2023

ACS Appl. Polym. Mater.

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Developing low-dielectric metal-adhesive polymer substrates for next-generation high-frequency communications and miniaturized electronic devices remains challenging. In this study, poly(ether ether ketone)-based copolymers (TB x BP y -PEEK) were synthesized via nucleophilic aromatic substitution of two aromatic alcohols: tertbutylhydroquinone and 4,4′-(α-methylbenzylidene)bisphenol. Neat film-type specimens, fabricated via solution casting with chloroform, exhibited a low dielectric constant and loss of 2.49 and 5.84 × 10 −3 , respectively, with a low water uptake of less than 0.5%. Furthermore, the films demonstrated excellent mechanical and thermal properties, achieving elastic moduli exceeding 0.884 GPa and initial decomposition temperatures exceeding 458.9 °C. Moreover, Cu-adhesive monomers glycidyl methacrylate and 3-(trimethoxysilyl)propyl methacrylate were successfully grafted onto the polymer surface by using the self-initiating property of the benzophenone moiety within the PEEK structure. The final Cu-polymer laminate displayed an outstanding peel strength of 11.45 N/m, more than double that of a commercially bonded sheet-laminated polyimide film.

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Section: Polymer Grafting and 90°peelmentioning

confidence: 99%

Section: Cu-adhesive Polymer Grafting and 90°peelmentioning

confidence: 99%

Section: Cu-adhesive Polymer Grafting and 90°peelmentioning

confidence: 99%

Section: Introductionmentioning

confidence: 99%

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Synthesis of Low-k Poly(ether ether ketone) Films and Surface Functionalization for Exceptional Copper Adhesive Properties

Jang,

Seo

2023

ACS Appl. Polym. Mater.

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“…At present, the main problem of two-layer FCCL during preparation is the good combination between the outer copper foil and the polymer film substrate. To solve this problem, researchers have done a lot of explorations. − Liu et al proposed the functionalization of polyimide (PI) surface by a cosilanization method to realize effective metal fixation and enhance adhesion. Chen et al activated the PI substrate by a laser to generate free radicals on the surface and induce the reduction and agglomeration of silver, thus triggering copper deposition.…”

Section: Introductionmentioning

confidence: 99%

Achieving Good Bonding Strength of the Cu Layer on PET Films by Pretreatment of a Mixed Plasma of Carbon and Copper

Wang

et al. 2023

ACS Appl. Mater. Interfaces

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Cu layers were fabricated on PET films with and without pretreatment by a mixed plasma composed of carbon and copper using a magnetron sputtering technique for potential application as the flexible copper-clad laminate (FCCL) in 5G technology. In order to evaluate the effect of carbon plasma on the composited layer, the graphite target current was adjusted from 0.5 to 2.0 A. The microstructures and properties of Cu layers on PET films with different treatments were measured by an X-ray powder diffractometer, X-ray photoelectron spectroscope, Raman spectroscope, scanning electron microscope, transmission electron microscope, scratching test, indentation test, and four-probe detector. The results showed that the organic polymer carbon structure on the surface of PET films was changed to inorganic amorphous carbon due to the effect of the carbon plasma. At the same time, the active free radicals formed in the transition process react with metal copper ions to form organometallic compounds. Under the treatment of a mixed plasma of carbon and copper, the C/Cu mixed layer was formed on the PET film at the top of the substrate. Due to the presence of C/Cu mixed interlayers, the bonding strengths between the final Cu layers and the PET film substrates were improved, and the strongest bonding strength appeared when the graphite target current was 1.0 A. In addition, the presence of the C/Cu mixed interlayer enhanced the toughness of the Cu layer on PET film. It was proposed that the good bonding strength in combination and the enhanced toughness for the Cu layer on a PET film was due to the formation of a C/Cu mixed interlayer induced by the pretreatment of a mixed plasma of carbon and copper.

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An Enhanced Interlayer Construction Strategy for High‐Frequency Copper Clad Laminates: Resolving the Contradiction between Signal Loss and Adhesion

Mei,

Yang,

Lei

et al. 2023

Adv Materials Technologies

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In high‐frequency printed circuit boards (PCBs), there is an inherent contradiction between minimizing signal loss and maximizing adhesion strength. To tackle this issue, this work presents a simple approach by developing an enhanced interlayer through a two‐step process involving anodization/APTES (3‐aminopropyltriethoxysilane) treatment. The anodization yields micro/nano oxide structures with low surface roughness, thereby reducing the skin effect. One side of the enhanced interlayer is mechanically anchored and chemically bonded to copper foils, while the other side is coupled with bismaleimide/triazine‐based resins (BT resins), significantly augmenting the adhesion strength. Eight‐layer PCBs manufactured employing this method exhibit an insertion loss of −1.3553 dB in−1 at 32 GHz. Compared to two conventional brown oxide methods, the insertion loss is reduced by 7.80% and 3.24%, respectively, with a more substantial reduction observed at higher frequencies. The peel strength of samples ranges from 0.554 to 0.589 N mm−1, demonstrating maximum enhancements of 34.78% and 164.13% in comparison to the two brown oxide methods, respectively. Moreover, eight‐layer PCBs undergo lead‐free reflow soldering tests, solder float tests, and thermal fatigue tests without encountering any failures. Consequently, the proposed method holds significant practical significance in addressing the challenge associated with low signal loss and high adhesion strength in high‐frequency PCBs.

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Formation of a robust Cu adhesive layer on poly(ether ether ketone) via self UV-initiated surface polymerization

Cited by 8 publications

References 33 publications

Synthesis of Low-k Poly(ether ether ketone) Films and Surface Functionalization for Exceptional Copper Adhesive Properties

Synthesis of Low-k Poly(ether ether ketone) Films and Surface Functionalization for Exceptional Copper Adhesive Properties

Achieving Good Bonding Strength of the Cu Layer on PET Films by Pretreatment of a Mixed Plasma of Carbon and Copper

An Enhanced Interlayer Construction Strategy for High‐Frequency Copper Clad Laminates: Resolving the Contradiction between Signal Loss and Adhesion

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