Epitaxial thin-film growth enables
novel functionalities, particularly
if significant barriers to integration with existing technologies,
scalability and excessive temperature of films, can be addressed.
Here, we demonstrate a step toward addressing both challenges by combining
hybrid molecular beam epitaxy and atomic layer deposition to epitaxially
integrate BiFeO3 on Si wafers via a SrTiO3 metamorphic
buffer layer. The solid–solid transformation of atomic-layer-deposited
amorphous Bi–Fe–O films into epitaxial BiFeO3 thin films is investigated by in situ annealing utilizing transmission
electron microscopy. The amorphous Bi–Fe–O layer undergoes
a very complex crystallization process, encompassing phenomena such
as reorientation, recrystallization, and grain growth. Our in situ
transmission electron microscopy study revealed that a growth front
of epitaxial crystallites emerged from the interface with the (001)-oriented
SrTiO3 as temperature increased, whereas randomly oriented
BiFeO3 crystallites formed simultaneously away from the
interface. Structural rearrangement and recrystallization of crystallites
took place at temperatures below 400 °C. At the final stage,
above 400 °C, epitaxial crystallites larger than 60 nm merged
into a single crystalline film. Our results demonstrate that this
approach permits high-quality epitaxial integration of BiFeO3 thin films at back-end-of-line-compatible temperatures below 500
°C on metamorphic SrTiO3 buffer layers on Si.