Formation of intermetallic compounds in SnAgBiIn solder systems on Cu substrates

Wu, Albert T.; Chen, Ming Hsun; Huang, Che Hsun

doi:10.1016/j.jallcom.2008.09.001

Cited by 23 publications

(9 citation statements)

References 29 publications

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“…The interfacial reaction between solder and Cu is necessary to form IMC to make strong metallurgical bonding, when the components are reflowed. Many papers [5][6][7][8][9][10] have indicated that the IMC Cu 6 Sn 5 ( phase) develops and Cu 3 Sn ( phase) forms between Cu 6 Sn 5 and Cu substrate, when the interconnect is aged at a higher homologous temperature. But excessive growth of the IMC during the service of the electronic components may undermine the joint to make the components fail, because of the brittleness of IMCs.…”

Section: Introductionmentioning

confidence: 99%

Bismuth segregation enhances intermetallic compound growth in SnBi/Cu microelectronic interconnect

Kang

Xiu

Liu

et al. 2011

Journal of Alloys and Compounds

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Section: Introductionmentioning

confidence: 99%

Bismuth segregation enhances intermetallic compound growth in SnBi/Cu microelectronic interconnect

Kang

Xiu

Liu

et al. 2011

Journal of Alloys and Compounds

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“…These bright particles have also been found in Sn-Ag-Bi-In solder, and are also identified as the f-phase. 15,16 These results suggest that f-phase particles are the most stable IMCs that form in Sn-Ag-In solder reactions with Cu substrates, regardless of whether Bi is present.…”

Section: F-phasementioning

confidence: 78%

“…15,16 This paper first discusses the effect of composition on the thermal properties of Sn-Ag-In, Sn-Ag-Bi, and Sn-Ag-Bi-In solders. Second, the interfacial reactions of Sn-Ag-Bi and Sn-Ag-In solders on Cu substrates and the growth kinetics of the interfacial IMCs are investigated.…”

Section: Introductionmentioning

confidence: 99%

Effects on Undercooling and Interfacial Reactions with Cu Substrates of Adding Bi and In to Sn-3Ag Solder

Chiang

Cheng

2010

Journal of Elec Materi

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This study investigated the effects of adding Bi and In to Sn-3Ag Pb-free solder on undercooling, interfacial reactions with Cu substrates, and the growth kinetics of intermetallic compounds (IMCs). The amount of Sn dominates the undercooling, regardless of the amount or species of further additives. The interfacial IMC that formed in Sn-Ag-Bi-In and Sn-In-Bi solders is Cu 6 Sn 5 , while that in Sn-Ag-In solders is Cu 6 (Sn,In) 5 , since Bi enhances the solubility of In in Sn matrices. The activation energy for the growth of IMCs in Sn-Ag-Bi-In is nearly double that in Sn-Ag-In solders, because Bi in the solder promotes Cu dissolution. The bright particles that form inside the Sn-Ag-In bulk solders are the f-phase.

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“…These voids caused by the unbalanced inter-diffusion ofcopper and tin at the interface between substrates and solder [10]. According to Schueller [79] and Yau et al [78], the formation of microvoids caused by cavities or empty bubbles in the copper (the source of the microvoids upon reflow) It is happened because of the interaction between silver and copper during silver plating process [11,75,76].…”

Section: Solder Joint Microstructure Of Immersion Silvermentioning

confidence: 99%

Electroless and Immersion Plating Process towards Structures and IMC Formation

Adawiyah¹,

Azlina²,

Fadil³

et al. 2016

IJET

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Abstract-The selection of surface finish on printed circuit board is very important in soldering process because it can prevent the copper from oxidation and provide solderable surface. It is also will influence the cost, manufacturing, shelf life, surface quality, final product reliability and environment.Electroless and immersion plating process has now become an important and popular surface finish in electronic industry due to simple and low cost process. The application of electroless plating are widely used in electronic industry, however it also was used in various industries such as aerospace, automotive, oil and gas, chemical processing where the need on the complex shape, homogeneous and uniform layer are required. Besides, every surface finish has their strength and weakness. Immersion silver is one of the surface finishes frequently used on the printed circuit board due to their characteristics such as good solderability and wettability, easy assembly and low cost. Both of these two processes were acts as barrier layer between copper substrate and solder balls. This review was discussed about electroless nickel and immersion silver plated on copper substrate, coating process and parameters involved. The topic also covered include the morphology and thickness of the intermetallics formed during soldering as well as the isothermal aging process.

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Formation of intermetallic compounds in SnAgBiIn solder systems on Cu substrates

Cited by 23 publications

References 29 publications

Bismuth segregation enhances intermetallic compound growth in SnBi/Cu microelectronic interconnect

Bismuth segregation enhances intermetallic compound growth in SnBi/Cu microelectronic interconnect

Effects on Undercooling and Interfacial Reactions with Cu Substrates of Adding Bi and In to Sn-3Ag Solder

Electroless and Immersion Plating Process towards Structures and IMC Formation

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