2003
DOI: 10.1063/1.1556966
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Formation of LaAlO3 films on Si(100) substrates using molecular beam deposition

Abstract: Effects of annealing on the electrical and interfacial properties of amorphous lanthanum scandate high-κ films prepared by molecular beam deposition

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Cited by 130 publications
(65 citation statements)
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“…LaAlO 3 with a perovskite-type structure [9] is widely used as substrates and electrically insulating buffers for depositing high-temperature superconducting films due to its high quality factor and excellent lattice and thermal expansion matching ability [2,6]. Its use as a gate dielectric material has also been explored [10,11] .In addition, LaAlO 3 powder has been studied as a catalyst for oxidative coupling of methane and hydrogenation and hydrogenolysis of hydrocarbons due to its high catalytic activity [12].Polycrystalline LaAlO 3 has been commonly prepared by a solidstate reaction method: i.e. direct mixing and firing of pure oxides of La 2 O 3 and Al 2 O 3 at temperature greater than 1550 •C [13][14][15][16].…”
Section: Introductionmentioning
confidence: 99%
“…LaAlO 3 with a perovskite-type structure [9] is widely used as substrates and electrically insulating buffers for depositing high-temperature superconducting films due to its high quality factor and excellent lattice and thermal expansion matching ability [2,6]. Its use as a gate dielectric material has also been explored [10,11] .In addition, LaAlO 3 powder has been studied as a catalyst for oxidative coupling of methane and hydrogenation and hydrogenolysis of hydrocarbons due to its high catalytic activity [12].Polycrystalline LaAlO 3 has been commonly prepared by a solidstate reaction method: i.e. direct mixing and firing of pure oxides of La 2 O 3 and Al 2 O 3 at temperature greater than 1550 •C [13][14][15][16].…”
Section: Introductionmentioning
confidence: 99%
“…Furthermore, it is anticipated that deposited films may remain amorphous even in the presence of a relatively high-temperature processing (in fact, probably to 800− 850°C) so that potential sources of leakage current via grain boundaries 3 should be absent. Preliminary measurements on amorphous deposited films [4][5][6] suggest that direct leakage currents are, in fact, extremely low (at least for amorphous films) at typical operational electric fields ͑ϳ1 MV cm −1 ͒ and electrical barrier heights are large enough to minimize carrier injection from the valence or conduction bands of the Si substrate. There is, however, significant confusion over the value of the dielectric constant of these films.…”
Section: Introductionmentioning
confidence: 99%
“…7 In the case of Si substrates, film/substrate interaction was evidenced, leading to dielectric constants 7 ϳ4.9, in the Pt case, k ϳ 25-27 is quoted. 7 Electron-beam evaporation methods have also been used, 6 in which the films were deposited onto heated Si substrates (temperatures up to 800°C) and values of k ϳ 21-25 quoted. This result is surprising since for the same range of substrate temperatures, the data in Refs.…”
Section: Introductionmentioning
confidence: 99%
“…Experimental studies have been restricted to amorphous or polycrystalline LAO layers on silicon [11,12,13,14]. Theoretical contributions are limited to a study of a (2 × 1) reconstructed interface [15].…”
mentioning
confidence: 99%