2022
DOI: 10.3390/s22134723
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Four-Level Micro-Via Technology (4LµV) for ASIC Integration in Active Flexible Sensor Arrays

Abstract: Systems-in-foil with multi-sensor arrays require extensive wiring with large numbers of data lines. This prevents scalability of the arrays and thus limits the applications. To enable multiplexing and thus reducing the external connections down to few digital data links and a power supply, active circuits in the form of ASICs must be integrated into the foils. However, this requires reliable multilayer wiring of the sensors and contacts for chip integration. As an elegant solution to this, a new manufacturing … Show more

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Cited by 2 publications
(2 citation statements)
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“…An electroplating solution was made by mixing copper sulfate (150–250 g/L) and sulfuric acid (15–60 g/L). A 1–10 A/dm 2 current ( Figure 2 ) was applied for several minutes depending on the desired thickness [ 23 , 24 , 25 ]. All solutions were made of chemically pure reagents and bi-distilled water.…”
Section: Methodsmentioning
confidence: 99%
“…An electroplating solution was made by mixing copper sulfate (150–250 g/L) and sulfuric acid (15–60 g/L). A 1–10 A/dm 2 current ( Figure 2 ) was applied for several minutes depending on the desired thickness [ 23 , 24 , 25 ]. All solutions were made of chemically pure reagents and bi-distilled water.…”
Section: Methodsmentioning
confidence: 99%
“…In the digital age of comprehensive health informatics, to realize continuous and real-time data collection throughout the day, lightweight and comfortable wearable sensors are indispensable . Soft and stretchable strain sensors, as one of the important elements in the family of wearable sensors, , have undergone development from traditional wire and/or foil strain gauges to ultrathin-film-state strain sensors, for the purpose of making them respond simultaneously to the epidermic changes , and realizing precise detection . In addition, numerous contributions have been made to strain sensors by the use of newly developed materials, such as low-dimensional carbon materials, , biomass, , metal nanowires, , MXene fabric, , as well as hydrogels , and composites loaded with nanoconductive fillers, as well as the recently proposed crack-based strain sensors by imitating slit sensilla of arthropods .…”
Section: Introductionmentioning
confidence: 99%