Disbond arrest features combined with a structural health monitoring system for permanent bondline surveillance have the potential to significantly increase the safety of adhesive bonds in composite structures. A core requirement is that the integration of such features is achieved without causing weakening of the bondline. We present the design of a smart inlay equipped with a micro strain sensor-system fabricated on a polyvinyliden fluorid (PVDF) foil material. This material has proven disbond arrest functionality, but has not before been used as a substrate in lithographic micro sensor fabrication. Only with special pretreatment can it meet the requirements of thin film sensor elements regarding surface roughness and adhesion. Moreover, the sensor integration into composite material using a standard manufacturing procedure reveals that the smart inlays endure this process even though subjected to high temperatures, curing reactions and plasma treatment. Most critical is the substrate melting during curing when sensory function is preserved with a covering caul plate that stabilizes the fragile measuring grids. The smart inlays are tested by static mechanical loading, showing that they can be stretched far beyond critical elongations of composites before failure. The health monitoring function is verified by testing the specimens with integrated sensors in a cantilever bending setup. The results prove the feasibility of micro sensors detecting strain gradients on a disbond arresting substrate to form a so-called multifunctional bondline.

Monitoring process parameters in the manufacture of composite structures is key to ensuring product quality and safety. Ideally, this can be done by sensors that are embedded during production and can remain as devices to monitor structural health. Extremely thin foil-based sensors weaken the finished workpiece very little. Under ideal conditions, the foil substrate bonds with the resin in the autoclaving process, as is the case when polyetherimide is used. Here, we present a temperature sensor as part of an 8 µm thick multi-sensor node foil for monitoring processing conditions during the production and structural health during the lifetime of a construction. A metallic thin film conductor was shaped in the form of a space-filling curve to suppress the influences of resistance changes due to strain, which could otherwise interfere with the measurement of the temperature. FEM simulations as well as experiments confirm that this type of sensor is completely insensitive to the direction of strain and sufficiently insensitive to the amount of strain, so that mechanical strains that can occur in the composite curing process practically do not interfere with the temperature measurement. The temperature sensor is combined with a capacitive sensor for curing monitoring based on impedance measurement and a half-bridge strain gauge sensor element. All three types are made of the same materials and are manufactured together in one process flow. This is the key to cost-effective distributed sensor arrays that can be embedded during production and remain in the workpiece, thus ensuring not only the quality of the initial product but also the operational reliability during the service life of light-weight composite constructions.

In comparison to bolted joints, structural bonds are the desirable joining method for light-weight composite structures. To achieve a broad implementation of this technology in safety critical structures, the issues of structural bonds due to their complex and often unpredictable failure mechanisms have to be overcome. The proposed multifunctional bondline approach aims at solving this by adding two safety mechanisms to structural bondlines. These are a design feature for limiting damages to a certain size and a structural health monitoring system for damage detection. The key question is whether or not the implementation of both safety features without deteriorating the strength in comparison to a healthy conventional bondline is possible. In previous studies on the hybrid bondline, a design feature for damage limitations in bondlines by means of disbond stopping features was already developed. Thus, the approach to evolve the hybrid bondline to a multifunctional one is followed. A thorough analysis of the shear stress and tensile strain distribution within the hybrid bondline demonstrates the feasibility to access the status of the bondline by monitoring either of these quantities. Moreover, the results indicate that it is sufficient to place sensors within the disbond stopping feature only and not throughout the entire bondline. Based on these findings, the three main working principles of the multifunctional are stated. Finally, two initial concepts for a novel multifunctional disbond arrest feature are derived for testing the fundamental hypothesis that the integration of micro sensors into the disbond stopping feature only enables the crack arrest and the health monitoring functions, while reaching the mechanical strength of a conventional healthy epoxy bondline. This work therefore provides the fundamentals for future investigations in the scope of the multifunctional bondline.

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Systems-in-foil with multi-sensor arrays require extensive wiring with large numbers of data lines. This prevents scalability of the arrays and thus limits the applications. To enable multiplexing and thus reducing the external connections down to few digital data links and a power supply, active circuits in the form of ASICs must be integrated into the foils. However, this requires reliable multilayer wiring of the sensors and contacts for chip integration. As an elegant solution to this, a new manufacturing process for multilayer wiring in polyimide-based sensor foils has been developed that also allows ASIC chips to be soldered. The electrical four-level micro-via connections and the contact pads are generated by galvanic copper deposition after all other process steps, including stacking and curing of polyimide layers, are completed. Compared to layer by layer via technology, the processing time is considerably reduced. Because copper plating of vias and solderable copper contact pads happens as the final step, the risk of copper oxidation during polyimide curing is completely eliminated. The entire fabrication process is demonstrated for six strain sensor nodes connected to a surface-mounted ASIC as a detecting unit for sensing spatially resolved bending states. Each sensor node is a full-bridge configuration consisting of four strain gauges distributed across interconnected layers. The sensor foil allows bending of +/- 120° without damage. This technology can be used in future for all kinds of complex flexible systems-in-foil, in particular for large arrays of sensors.