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Disbond arrest features combined with a structural health monitoring system for permanent bondline surveillance have the potential to significantly increase the safety of adhesive bonds in composite structures. A core requirement is that the integration of such features is achieved without causing weakening of the bondline. We present the design of a smart inlay equipped with a micro strain sensor-system fabricated on a polyvinyliden fluorid (PVDF) foil material. This material has proven disbond arrest functionality, but has not before been used as a substrate in lithographic micro sensor fabrication. Only with special pretreatment can it meet the requirements of thin film sensor elements regarding surface roughness and adhesion. Moreover, the sensor integration into composite material using a standard manufacturing procedure reveals that the smart inlays endure this process even though subjected to high temperatures, curing reactions and plasma treatment. Most critical is the substrate melting during curing when sensory function is preserved with a covering caul plate that stabilizes the fragile measuring grids. The smart inlays are tested by static mechanical loading, showing that they can be stretched far beyond critical elongations of composites before failure. The health monitoring function is verified by testing the specimens with integrated sensors in a cantilever bending setup. The results prove the feasibility of micro sensors detecting strain gradients on a disbond arresting substrate to form a so-called multifunctional bondline.

Bonding is known for its wide range of advantages over bolted joints when joining different materials together. However, the advantages e.g. of homogeneous load distribution can quickly be lost in case of overload. For this reason, the load occurring in the adhesive is reduced by constructive measures far below the yield stress of the adhesive, which leads to a conservative joint design. And to be on the safe side, a few “chicken rivets” are then placed again. This problem is particularly well known in aviation. Highly loaded components are structurally bonded by a combination of rivets and adhesive in order to underline the advantages of structural adhesive bonding with the safety of the well-known bolted joints. Known as fail-safe design, this concept is damage tolerant and more robust against manufacturing defects through a secured double load path.  Especially when joining fiber-reinforced composites, bolts weaken the adherends of the joint and only contribute to load transfer when the brittle adhesive fails. With the help of Surface Toughening, a boltless technique for reducing stress concentrations and arresting cracks in adhesive bonded joints is available. This work describes the industrial application of this technique. Starting with coupon tests and a small scale demonstrator to ensure the compatibility with industrial manufacturing processes, such as infusion and prepreg manufacturing, a large scale demonstrator of a 2 m carbon fiber reinforced plastic (CFRP) - HTP leading edge with hybrid laminar flow control is manufactured by the industrial partner AERnnova. Verifying a simple and cost-effective application of the technology, Surface Toughening enables robust bonded joints with a minimum impact on today's process of adhesive bonding.

Structural bonding and bonded repairs of composite materials become more and more important.Understanding the strain within the bondline leads to suitable bonding design. For new design approaches the strain distribution within the bondline has to be analyzed. Thus, often finite element analysis (FE) are used.However, a huge challenge is the availability of reliable material properties for the adhesives and their validation. Previous work has shown that it is possible to measure the small displacements resulting within thin epoxy film adhesives using high resolution digital image correlation (DIC). In this work a 2D DIC setup with a high resolution consumer camera is used to visualize the strain distribution within the bondline over the length of the joint as well as over the adhesive thickness. Therefore, single lap joints with thick aluminum adherends according to ASTM D 5656 are manufactured and tested. Local 2D DIC strain measurements are performed and analyzed. Two different camera setups are used and compared. The evaluation provides reliable material data and enables a look insight the bondline. The results of the full field strain data measured with DIC are compared with numerical simulations. Thus, material models as well as chosen parameters for the adhesive are validated. Compared to extensometers, giving only point-wise information for fixed measuring points, the DIC allows a virtual point-wise inspection along the complete bondline. Furthermore, it allows measuring close to the bondline to reduce the influence of adherend deformation.