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Structural bonding and bonded repairs of composite materials become more and more important.Understanding the strain within the bondline leads to suitable bonding design. For new design approaches the strain distribution within the bondline has to be analyzed. Thus, often finite element analysis (FE) are used.However, a huge challenge is the availability of reliable material properties for the adhesives and their validation. Previous work has shown that it is possible to measure the small displacements resulting within thin epoxy film adhesives using high resolution digital image correlation (DIC). In this work a 2D DIC setup with a high resolution consumer camera is used to visualize the strain distribution within the bondline over the length of the joint as well as over the adhesive thickness. Therefore, single lap joints with thick aluminum adherends according to ASTM D 5656 are manufactured and tested. Local 2D DIC strain measurements are performed and analyzed. Two different camera setups are used and compared. The evaluation provides reliable material data and enables a look insight the bondline. The results of the full field strain data measured with DIC are compared with numerical simulations. Thus, material models as well as chosen parameters for the adhesive are validated. Compared to extensometers, giving only point-wise information for fixed measuring points, the DIC allows a virtual point-wise inspection along the complete bondline. Furthermore, it allows measuring close to the bondline to reduce the influence of adherend deformation.

Because of a planar load introduction, a high strength over weight ratio, avoidance of holes, corrosion resistance and component reduction, adhesively bonded joints attract increasing attention in lightweight construction. Nonetheless, a reliable prediction of the joints' behaviour in terms of stress and strength is still

In comparison to bolted joints, structural bonds are the desirable joining method for light-weight composite structures. To achieve a broad implementation of this technology in safety critical structures, the issues of structural bonds due to their complex and often unpredictable failure mechanisms have to be overcome. The proposed multifunctional bondline approach aims at solving this by adding two safety mechanisms to structural bondlines. These are a design feature for limiting damages to a certain size and a structural health monitoring system for damage detection. The key question is whether or not the implementation of both safety features without deteriorating the strength in comparison to a healthy conventional bondline is possible. In previous studies on the hybrid bondline, a design feature for damage limitations in bondlines by means of disbond stopping features was already developed. Thus, the approach to evolve the hybrid bondline to a multifunctional one is followed. A thorough analysis of the shear stress and tensile strain distribution within the hybrid bondline demonstrates the feasibility to access the status of the bondline by monitoring either of these quantities. Moreover, the results indicate that it is sufficient to place sensors within the disbond stopping feature only and not throughout the entire bondline. Based on these findings, the three main working principles of the multifunctional are stated. Finally, two initial concepts for a novel multifunctional disbond arrest feature are derived for testing the fundamental hypothesis that the integration of micro sensors into the disbond stopping feature only enables the crack arrest and the health monitoring functions, while reaching the mechanical strength of a conventional healthy epoxy bondline. This work therefore provides the fundamentals for future investigations in the scope of the multifunctional bondline.